PowerTech Technology expects stronger memory packaging and testing demand and higher ASPs in Q4 2026, driving revenue to a record high. The company is ramping up TSV DDR5 production and utilizing its AMD-ordered FOPLP line for future growth.
TDK expands its B43645-B43661 series aluminum electrolytic capacitors to 500V rated voltage for AI server power supplies. This capacity expansion targets high power density requirements in data centers.
Chinese DRAM maker CXMT plans to build a 3D NAND R&D line at its second Beijing facility, targeting AI and supercomputing applications. The project is still in the early stages, with no operational timeline or technical details confirmed.
ClassOne Technology secured follow-on orders for Solstice S8 wet processing systems from leading photonics manufacturers. These systems are configured for high-volume gold electroplating of 4-inch and 6-inch InP wafers used in AI data centers. Bullish: The orders signal increased capacity and demand for InP wafer processing in high-bandwidth applications.
Emdoor Information expands ODM customization capabilities for rugged computing, increasing daily output to over 400 units with delivery lead times of 7 to 30 days. This capacity expansion reflects growing demand for specialized industrial hardware. The impact on standard chip spot prices is neutral.
Hua Hong Semiconductor announced a $2 billion expansion in Wuxi, adding 55,000 wafers per month to address high utilization rates and shortages in power semiconductors and specialty analog chips. This capacity increase is bearish for prices as it alleviates supply constraints.
iPronics raised $125M Series B led by Maverick Silicon and Light Street Capital, with NVIDIA participating, to accelerate commercialization of silicon photonics optical switching for AI data centers. This funding supports scaling high-density optical solutions to meet the growing bandwidth and energy efficiency demands of AI workloads.
CXMT plans to build its sixth DRAM fab in Beijing, aiming to double monthly wafer starts to over 600,000. This expansion relies on government funding and targets 30% market share by 2030. Bearish - Increased capacity will likely lead to oversupply and downward pressure on DRAM prices.
Samsung Display has revived its 67 trillion KRW OLED expansion plan to upgrade facilities and build new lines. This move aims to counter Chinese competition despite recent demand weakness. Bearish: Capacity expansion exacerbates oversupply, pressuring OLED prices.
Tower Semiconductor is expanding 300mm Silicon Photonics and SiGe capacity in Japan, targeting Q4 2027 production. Supported by the Japanese government, the expansion aims to meet long-term demand and achieve $3.6B revenue by 2028. Bullish for long-term supply security and company growth.
Infineon opened its Smart Power Fab in Dresden with a €5 billion investment, ahead of schedule, establishing Europe's largest power semiconductor manufacturing site. This represents the largest single investment in the company's history. Bearish: The massive capacity expansion may alleviate supply constraints and exert downward pressure on prices.
Teledyne MEMS is expanding its manufacturing operations in Edmonton with a CAD 620,000 grant, adding new wafer processing and automation equipment to meet rising global demand for MEMS sensors.
Nexchip Semiconductor is raising $890 million to fund a $5.1 billion 40/28nm fab in Hefei, targeting automotive chips and CMOS image sensors. Despite a 32% profit margin last year, the company anticipates reduced earnings this year due to heavy depreciation from the new facility. This capacity expansion signals potential oversupply and bears a bearish outlook for spot prices.
LG Innotek plans to invest over 1 trillion KRW in a new semiconductor substrate plant in Vietnam to meet rising demand from AI servers and 5G smartphones. The expansion targets RF-SiP, FC-CSP, and FC-BGA substrates as suppliers adjust capacity for advanced mobile and AI infrastructure. Watch.
ROHM Semiconductor is partnering with Aixtron to install a G10-GaN MOCVD system at its Hamamatsu plant to produce 8-inch GaN epitaxial wafers for 650V and 100V power devices. This move establishes in-house GaN epitaxy capabilities. Traders should watch for supply stability improvements and potential cost reductions in ROHM's power device portfolio.
Kioxia plans an average annual capex of ¥470 billion for FY2026-2028, up 66% from FY2025, to fund a potential third Kitakami fab. Despite current utilization at ~50%, supply-demand is expected to remain tight through 2027 driven by an 86% CAGR in inference AI NAND demand. Bullish for NAND pricing and supply constraints.
AMD CEO Lisa Su announced plans to invest over $10 billion in Taiwan's industrial ecosystem to accelerate AI infrastructure development. She shared latest progress on collaborations with TSMC regarding backend packaging, substrates, and AI server supply chains. Bullish outlook for AMD and TSMC's AI chip demand and supply chain cooperation.
Tower Semiconductor secured $1.3bn in silicon photonics contracts for 2027 revenue and received $290m in prepayments for capacity reservation. This indicates strong demand for SiPho capacity and tight supply outlook.
SMIC founder Richard Chang notes that 80% of semiconductor demand lies outside advanced nodes, favoring niche markets. TrendForce reports customers in HV processes and CIS are migrating to Chinese foundries since H2 2025 due to Taiwanese capacity shifts and price hikes. Bullish for SMIC's mature node capacity and pricing as demand for 90nm+ wafers surges.
Bosch launched its third-generation SiC chips and announced a massive $5 billion investment to expand production capacity. The company aims to meet rising EV demand using advanced 200mm wafer technology. Bearish: The significant capacity expansion signals potential oversupply pressure on SiC prices in the medium term.
Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.
iPhone DuoFirst-pass BOM: 37 parts, 12 brands and 16 public MPNs; A20 Pro, C2, N1 and the power/RF chains are located, while the NAND brand stays unconfirmed.See the full teardownAll teardowns| Analog | $0.68 | −5.9% |
|---|---|---|
| Connector | $0.75 | +0.2% |
| CPU | $386.74 | −21.3% |
| DDR4 | $88.40 | −0.2% |
| DDR52026-W13 | $14.89 | −11.2% |
| GPU | $478.20 | +8.2% |
| MCU | $0.68 | −61.7%Unusual |
| MLCC | $0.01 | +54.0%Unusual |
| MOSFET | $0.12 | −82.8%Unusual |
| PMIC2026-W13 | $0.44 | −12.5% |
| SSD/HDD | $288.43 | n/a |