NuAxi Stream - Real-Time Semiconductor Intelligence

Mon, Oct 26

06:30Impact score 60
Intel Begins Equipment Installation at Arizona Fab 62, Targets Late 2028 Operations
Intel confirmed on Oct. 22 local time that construction and equipment installation are underway at Fab 62 on its Ocotillo campus in Arizona, with plans to begin operating the facility by the end of 2028; the fab is expected to use the company's 1.4-nanometer-class Intel 14A process. Naga Chandrasekaran, executive vice president and chief technology and operations officer of Intel Foundry, said Fab 62 will be the sixth high-volume manufacturing facility at the Ocotillo campus. Intel began constructing Fab 52 and Fab 62 in 2021; Fab 52 was completed in 2023 and has been mass-producing chips on the Intel 18A process (combining RibbonFET and PowerVia technologies) since late 2025. Intel's $28 billion plant in New Albany, Ohio, recently installed its first major roof truss; originally scheduled for completion in 2025, it is now expected to be completed in 2030 due to funding difficulties. Intel also plans to be the first in the industry to deploy High NA-EUV lithography equipment in mass production at its Oregon facility, carries out large-scale advanced packaging production in New Mexico, and has begun construction on a new mask manufacturing facility in Santa Clara, California.
Intel 14A processIntel 18A processHigh NA-EUV lithography equipmentIntelThe ElecCapacity Change

Sun, Oct 25

08:41Impact score 58
Magnate Technology sees aerospace, semiconductor growth opportunities
Magnate Technology expects rising aircraft engine demand and semiconductor equipment opportunities to support its growth while it expands production capacity. The aerospace components maker forecasts revenue of nearly NT$2 billion (US$61.5 million) in 2026 and expects 15% to 20% revenue growth in 2027. These figures are company forecasts/expectations, not achieved results.
semiconductor equipmentaircraft engine componentsMagnate TechnologyDigiTimes AsiaCapacity Change

Fri, Oct 23

23:32Impact score 55
Micron's next-generation 3D NAND to double bit density with over 400 layers, offering extreme performance
At an event this week, Micron announced that its next-generation 3D NAND (G11), which it plans to enter mass production in 2H 2027, is set to offer three significant advantages: doubling storage density (approximately twice the bit density of G9, with 3D TLC going from 21 Gb/mm² to 42 Gb/mm²), increasing I/O performance by up to 50% versus the company's current-generation NAND memory (interface speed from 3,600 MT/s to 5,400 MT/s), and reducing data transfer energy consumption per bit by more than 25%. G11 will adopt wafer-on-wafer bonding, manufacturing the NAND array on a new 3D NAND node and the peripheral circuits and I/O on a logic process before bonding them together, and will transition to more than 400 NAND layers; Micron has not disclosed the exact number of active wordline layers or memory decks. Micron executive Scott DeBoer described G11 as the world's most advanced NAND, ramping in the second half of next year. Micron also expects to disclose more G11 technical details in 2027 and, beyond G11, is developing high-mobility materials and denser cell architectures to continue XYZ scaling; specific architectural details, density targets, or production schedules for post-G11 generations have not been disclosed. These are the company's stated plans and expectations; mass production has not yet occurred.
3D NANDG11 3D NANDMicronTom's HardwareCapacity Change
21:34Impact score 60
MicroVision Begins Commercial Production of MOVIA(TM) Pro for Superior Short-Range Sensing and Onboard Perception, Enabling Physical AI at the Edge
MicroVision, Inc. (NASDAQ: MVIS) announced the commercial production launch of MOVIA™ Pro and is shipping sensors to meet customer demand. MOVIA Pro is the company's next-generation short-range lidar sensor and the production-ready version of MOVIA S, featuring onboard perception, multi-echo sensing, and an integrated processing architecture that lets perception software run directly on the sensor via MicroVision's Open Software Framework. The company's Orlando-based production facility is manufacturing MOVIA Pro to meet increasing demand; CEO Glen DeVos said customers are progressing from evaluating prototypes to launching commercial programs. The sensor targets applications including intelligent infrastructure, unmanned aerial systems, warehouse and industrial automation (AMRs, AGVs, forklift ADAS), security and defense, and selected automotive uses. No price or volume figures were provided in the announcement.
MOVIA Pro short-range lidar sensorMicroVision, Inc. (NASDAQ: MVIS)EE JournalCapacity Change
15:17Impact score 60
YMTC to Start Mass Production of LPDDR5X with 9,600 MT/s Speed
According to Counterpoint Research, YMTC, known primarily as a NAND Flash manufacturer, has been producing about 5,000 wafers per month of 16 Gb LPDDR5X DRAM running at 7,500 MT/s at its Fab 2 since October 2025. The company is now preparing to begin volume production of LPDDR5X memory with speeds of 9,600 MT/s at its Fab 3, using Vertical Channel Transistor (VCT) 4F² cell structure technology. The volume production remains in the preparation stage and is a planned event.
LPDDR5X DRAM16 Gb LPDDR5X DRAMYMTCTechPowerUpCapacity Change
11:44Impact score 60
Tesla, Nvidia reportedly invest KRW3.7 trillion to secure Samsung Electro-Mechanics ABF capacity
Tesla and Nvidia are reportedly investing a combined KRW3.7 trillion (US$2.8 billion) to help Samsung Electro-Mechanics expand Ajinomoto Build-up Film (ABF) substrate production facilities in South Korea. The move reflects growing efforts by global technology companies to secure stable supplies of high-performance semiconductor substrates for AI applications.
ABF substrateSamsung Electro-MechanicsDigiTimes AsiaCapacity Change
10:10Impact score 55
Western Digital bets on pricing and HAMR, not new capacity, as Toshiba plans to double output
On its October 22 earnings call, Western Digital explained how it intends to meet a sharp rise in hard-drive demand: it will not build more drives, but will keep raising price per terabyte, pack more data into each drive, and spend its capital on recording heads and disk media rather than assembly capacity. That leaves its growth dependent on how quickly it moves to heat-assisted magnetic recording (HAMR), a technology in which Seagate is already shipping at scale. Per the title, Toshiba plans to double output. The stated cause is a sharp rise in hard-drive demand.
hard drivesWestern Digital, Toshiba and 3 totalDigiTimes AsiaCapacity Change
09:35Impact score 58
Unitree's cumulative G1 humanoid robot output reaches 10,000–20,000 units
Unitree Robotics' cumulative G1 humanoid robot output has reached 10,000–20,000 units, and the company continues to expand production of its humanoid robots but still faces challenges in production capacity and artificial intelligence (AI) technology as it works to scale up production for widespread adoption. The expansion is planned/ongoing and the stated challenges are not reported as resolved.
G1 humanoid robotUnitree RoboticsDigiTimes AsiaCapacity Change
08:32Impact score 60
PSMC eyes Taiwan, Japan, Singapore for 3D AI foundry expansion
Powerchip Semiconductor Manufacturing (PSMC) is urgently expanding its 3D AI foundry business, evaluating new plants in Taiwan, Singapore, and Japan, while exploring strategic joint ventures with customers. Its product portfolio includes integrated passive devices (IPDs), interposers, wafer-on-wafer (WoW) technology, and post-wafer finish (PWF) services; as AI server power consumption rises, demand for IPDs is expected to remain visible through 2028. The expansion is at the planning stage, with no construction or volume-production facts reported.
3D AI foundryintegrated passive devices (IPDs)interposersPowerchip Semiconductor Manufacturing (PSMC)DigiTimes AsiaCapacity Change
06:49Impact score 60
Daeduck Electronics Adds 615 Billion Won Investment
Daeduck Electronics said in a regulatory filing on Oct. 22 that it will invest an additional 615 billion won in semiconductor production equipment and ancillary facilities to expand semiconductor substrate production capacity. The amount represents 68.54% of its consolidated equity at the end of 2025, the investment will run through Dec. 31, 2030, and it will be financed through existing funds and external borrowing. The announcement comes three months after the company unveiled a 497 billion won investment in July; the three new facility investments disclosed in 2026 total 1.325 trillion won. In May, the company unveiled a 213 billion won investment to establish a flip-chip chip-scale package (FC-CSP) production plant at its B1 Center in Siheung, Gyeonggi Province; in July, it announced another 497 billion won investment to expand production of flip-chip ball grid array (FC-BGA), FC-CSP and memory substrates, with both projects scheduled for completion by the end of 2027. In July, it also acquired Newflex's Ansan factory for 52.8 billion won, an acquisition separate from the disclosed investments in new facilities. Daeduck Electronics has been negotiating long-term agreements (LTAs) with several global technology companies for FC-BGA, FC-CSP and memory substrates, and is expanding capacity using advance payments received from customers. In its filing, the company said the investment is intended to expand production equipment and ancillary facilities to meet growing demand in the semiconductor market.
semiconductor substratesFC-BGAFC-CSPDaeduck ElectronicsThe ElecCapacity Change
06:49Impact score 60
LG Display Plans to Restart Idle OLED Capacity
On its third-quarter earnings conference call held on Oct. 22, LG Display said it plans to gradually restart idle OLED production capacity in proportion to demand growth, taking into account demand conditions in downstream markets such as TVs and monitors and its optimal internal production mix; the company cited rising demand for large OLED panels and continued increases in utilization rates at its operating facilities. LG Display projects large OLED panel shipments to increase about 20% year-on-year to the upper end of the 7 million-unit range in 2026, a figure that includes panels for TVs and monitors, with monitors expected to account for approximately 20% of total shipments in 2026, up from the low-teens percentage range in 2025. Based on its gaming monitor lineup using white OLED (WOLED) technology, the company expects its large OLED business to continue growing in 2027 while the TV market remains stagnant, and it plans to improve utilization of existing production infrastructure and reduce manufacturing costs. For the fourth quarter, LG Display expects total panel shipment area to increase approximately 10% from the previous quarter due to seasonal demand, but given rising semiconductor and raw material prices and uncertainty over end-product demand, it expects the increase in average selling price per unit area to remain in the low single digits.
large OLED panelsOLED monitor panelsWOLED (white OLED) monitor panelsLG DisplayThe ElecCapacity Change
05:41Impact score 60
Intel Fab 62 Moves to Next Phase, Begins Equipment Installation
Intel has begun installing equipment at Fab 62 within its Ocotillo campus in Chandler, Arizona. According to Intel officials, construction and equipment installation are currently underway, with production projected to begin by the end of 2028. Naga Chandrasekaran, Executive Vice President of Intel Foundry and Chief Technology and Operations Officer, stated: 'Today, I am pleased to share that construction and tool installation at Fab 62 are now fully underway, and we expect operations to begin by the end of 2028.' Reaching this stage comes more than a year after Intel had Fab 52 at full production capacity. Fab 62 could support the 18A, 18A-P, and 14A process nodes, however the company has not confirmed which ones; the next-door Fab 52 already manufactures chips on the 18A node, currently producing Panther Lake processors and Clearwater Forest server CPUs using the 18A process. It can be presumed that the new facility could either expand existing capacity or support the next-generation 14A process, but this remains unconfirmed by the company. Intel also reported progress in Ohio, where the first major structural truss has been installed on the first fab in New Albany.
18A18A-P14AIntelTechPowerUpCapacity Change

Thu, Oct 22

20:09Impact score 60
Semtech secures dedicated SiGe capacity at Tower
Semtech will invest in dedicated silicon germanium (SiGe) capacity at Tower Semiconductor under an expanded multi-year agreement. The capacity spans Tower's fabs in the US, Israel and Japan and will support Semtech's growing business in optical and copper interconnect components for AI data centres. The two companies have worked together for 20 years; Semtech's signal integrity products, including transimpedance amplifiers (TIAs), modulator and laser drivers and linear equalisers, are built on Tower's SiGe process technology and are used in optical transceivers and active copper cables. According to the companies, spreading the capacity across three regions gives Semtech better supply security and geographic diversification; the agreement builds on current production and comes as Semtech expects demand for its SiGe-based products to grow across more customer programmes and end markets. The companies also work together on a joint technology roadmap for future interconnect generations. The companies have not disclosed the size of Semtech's investment or how much capacity it secures.
silicon germanium (SiGe) capacitysignal integrity productstransimpedance amplifiers (TIAs)Semtech, Tower SemiconductorEvertiqCapacity Change
18:05Impact score 60
Hana Technology to Ship Battery Equipment to India’s Agratas in November
According to industry sources on Oct. 22, Hana Technology completed factory acceptance testing (FAT) this month for battery cell electrolyte filling and baking equipment destined for Agratas, a battery subsidiary of India's Tata Group, and the equipment will be shipped to Agratas' factory in India in November, while some assembly equipment is reportedly still under production. Hana Technology signed turnkey contracts with Agratas for battery assembly equipment worth 157.6 billion won in December 2025 and 161.5 billion won in June 2026, totaling 319.1 billion won; equipment for the first project awarded in 2025 is being manufactured and delivered in 2026. Shipments were delayed beyond initial expectations because performance verification took longer than anticipated following the first order in 2025, with a company official saying the testing period was extended by about one to two months; the company plans to begin delivering equipment for the first production line in the fourth quarter and subsequently supply equipment for additional lines in stages. Agratas' Sanand plant in Gujarat, India, has begun receiving production equipment, while its Bridgwater plant in Somerset, England, remains under construction; both facilities aim to gradually expand production capacity to 40 gigawatt-hours annually, and Agratas aims to complete equipment deliveries to its Indian factory by the first half of 2027. Hana Technology expects to recognize revenue from approximately 80 billion won worth of first-phase equipment in stages beginning in the fourth quarter (its consolidated first-half 2026 revenue was 13.6 billion won with a 10 billion won operating loss, revenue down 18 billion won and operating loss up 5.4 billion won from a year earlier); its order backlog rose to 482.5 billion won at the end of the second quarter, and if the project proceeds as planned, 2027 revenue is expected to roughly double from the 2025 level.
battery cell electrolyte filling equipmenthigh-temperature baking equipmentbattery assembly equipmentHana Technology, AgratasThe ElecCapacity Change
18:05Impact score 60
Nvidia Invests in AI Supply Chain to Expand Production Capacity
On Oct. 21 local time, Nvidia announced that, to meet growing demand for AI infrastructure, it is working with Samsung Electro-Mechanics, Ibiden, Amkor Technology, King Yuan Electronics Co. (KYEC), Siliconware Precision Industries (SPIL) and Unimicron, making advance payments to secure semiconductor packaging substrate, testing and co-packaged optics (CPO) capacity. CEO Jensen Huang said demand is enormous but capacity is constrained. Substrates: Nvidia is expanding agreements with Ibiden, Samsung Electro-Mechanics and Unimicron to increase semiconductor package substrate capacity 2.5-fold over the next three years; Nvidia has reserved several billion dollars worth of capacity at Ibiden with advance payments, aiming to triple capacity at its Ono plant in Japan, with the additional capacity expected to begin full-scale operations in the first quarter of 2028; Samsung Electro-Mechanics will begin supplying next-generation package substrates from its South Korean facilities in 2026, with Nvidia supporting equipment upgrades at its Sejong and Busan plants plus construction of a new factory; Nvidia signed a capacity reservation agreement with Unimicron to expand its KF plant in Taiwan, with capacity beginning to increase in the second quarter of 2027 and expected to reach full utilization by mid-2028. Advanced packaging: Nvidia is working with Amkor to expand capacity in Gwangju, South Korea, planning to increase interposer wafer capacity by more than 300% by the end of 2028. Testing: Nvidia committed $1.1 billion in advance payments to reserve capacity at KYEC; expansion in the United States, Taiwan and Singapore will double total testing capacity in 2027 from the 2026 level, with a new U.S. facility scheduled for mass production in April 2027 and Singapore lines in February 2027. CPO: Nvidia is expanding optical engine capacity for CPO with SPIL in Taiwan, rising 15-fold by mid-2027 and doubling again by the end of 2028. All expansions are planned/expected arrangements, not yet achieved results.
semiconductor package substratesFC-BGA substratesinterposersNvidia, Samsung Electro-Mechanics and 7 totalThe ElecCapacity Change
16:14Impact score 58
#TrendForce notes that #Micron plans to begin mass producing its 1-delta nm process in 2027, which is set to succeed its current mainstream 1-gamma nm...
TrendForce notes that Micron plans to begin mass producing its 1-delta (1δ) nm process in 2027, which is set to succeed its current mainstream 1-gamma (1γ) nm process. Beyond this transition, Micron intends to continue scaling its 6F² architecture before moving directly to 3D DRAM, bypassing the intermediate 4F² architecture; in contrast, South Korean and Chinese DRAM manufacturers still plan to adopt 4F² architecture, highlighting a growing divergence in process technology roadmaps among major suppliers. Micron is also developing memory solutions optimized for AI solutions, including vHBM and vEIM, to compete with SK hynix's 3D HBM and Samsung's zHBM. In NAND flash, Micron is preparing to ramp up production of its G11 generation in 2H27; by incorporating wafer bonding and stacking more than 400 layers, G11 is expected to deliver twice the bit density of G9, alongside a targeted 1.5-fold improvement in I/O speed. TrendForce believes these advances will enable Micron to close the technology gap with Kioxia and YMTC—both early adopters of hybrid bonding architectures—and strengthen its competitive position as NAND performance becomes increasingly critical to an AI-driven market. All of these remain plans/expectations, not yet realized mass production.
1-delta nm DRAM processvHBMvEIMMicronTrendForce Official (Market Data)Capacity Change
06:51Impact score 60
Samsung Electro-Mechanics, Nvidia to Expand FC-BGA Production
On Oct. 21, Samsung Electro-Mechanics announced it had signed a strategic business partnership with Nvidia to supply semiconductor package substrates. The two companies will jointly invest to establish dedicated production facilities for artificial intelligence (AI) semiconductor package substrates at Samsung Electro-Mechanics' Sejong and Busan plants; the plan to expand package substrate production lines through customer-backed investment, under consideration since the first half of 2026, has taken shape through the Nvidia partnership. The products include flip-chip ball grid array (FC-BGA) substrates for AI computing chips and for network switches that enable high-speed connections between chips in data centers. Samsung Electro-Mechanics will supply next-generation substrates from its Korean production facilities under a multiyear arrangement beginning in 2026. Supply volumes are expected to grow at a double-digit annual rate starting in 2026, and by 2028 Nvidia-related production is expected to account for a significant share of the company's total capacity. The substrates will also embed passive components including multilayer ceramic capacitors (MLCCs) and silicon capacitors (Si-Caps), which will help control power noise generated during ultra-high-speed computing and maximize power efficiency. This is a planned/expected expansion; implementation remains to be carried out.
FC-BGA substratesMLCCssilicon capacitors (Si-Caps)Samsung Electro-Mechanics, NvidiaThe ElecCapacity Change
03:35Impact score 60
Intel installs production tools at Fab 62 in Arizona, provides updates on Ohio chip fab
On 21 October 2026 (Wednesday), Intel announced that it had started installing production tools at its Fab 62 in Arizona, with the fab on track for mass production by late 2028; however, the company has not disclosed when it intends to begin high-volume production, the planned wafer processing capacity, the capital expenditures required to complete the facility, and it has not officially assigned Intel 14A to Fab 62 (Fab 62 remains unassigned, while Fab 52 has been designated for Intel 18A). Per Intel's manufacturing roadmap disclosed earlier this year, Fab 62 will be able to make chips on 18A, 18A-P, and 14A nodes. Intel also confirmed that it has integrated High-NA EUV lithography into high-volume manufacturing (HVM), used to produce select tiles for Panther Lake CPUs at its D1X fab in Oregon; Intel has not explicitly confirmed whether High-NA EUV scanners are currently used to produce the same circuits as Low-NA EUV machines. In addition, construction workers recently installed the first major structural truss at the first fab of the Ohio One complex in New Albany, Ohio, but Intel did not provide an updated construction schedule, disclose when the first fab is expected to begin operations, or reveal which process technology it will use or its estimated capacity. The source does not state the cause (this is a capacity expansion progress update, not a price or disruption event).
High-NA EUV lithographyIntel 18AIntel 18A-PIntelTom's HardwareCapacity Change
01:49Impact score 60
(PR) NVIDIA and Supply Chain Partners Expand Capacity to Accelerate AI Infrastructure Buildout
NVIDIA announced plans with a group of supply chain partners to expand global manufacturing capacity to meet growing demand for its accelerated computing and full-stack AI factory platform. The partners include Amkor Technology, IBIDEN, King Yuan Electronics (KYEC), Samsung Electro-Mechanics, Siliconware Precision Industries (SPIL) and Unimicron Technology Corporation, with expansion of critical manufacturing capabilities across substrates, advanced packaging, testing and optical engines, covering both new and existing suppliers, to strengthen the resiliency and redundancy of NVIDIA's global supply chain. This is an announced expansion plan only; the source does not indicate the capacity changes have been implemented.
substratesadvanced packagingtestingNVIDIA, Amkor Technology and 7 totalTechPowerUpCapacity Change

Wed, Oct 21

23:30Impact score 58
ASML and other critical semiconductor equipment suppliers expedite shipments to Musk's Terafab
Elon Musk said on October 20, during a live broadcast of SpaceX's Q3 2026 earnings call on X, that ASML and other critical semiconductor equipment suppliers have expedited shipments to the Terafab semiconductor manufacturing facility, a joint megaproject between Tesla and SpaceX, to support his aggressive timeline. He said the company is targeting volume chip production at Terafab's primary facility in Gibbons Creek, Texas, by the third or fourth quarter of 2028, emphasizing that the timeline is highly aspirational and carries 'big error bars'; SpaceX plans to manufacture its first experimental test chip at its research fabrication facility in Austin, Texas, around Q2 2027. Terafab will use traditional extreme ultraviolet (EUV) lithography systems utilizing Intel's 14A manufacturing node; Intel officially joined the Terafab venture in April 2026 to co-develop and refactor silicon fabrication technology. According to unofficial sources, Terafab's first EUV tool was reportedly slated for delivery in mid-2027, and it remains unclear if this is the expedited timeline Musk referred to. Other major suppliers include Applied Materials, Lam Research, and KLA Corporation, as well as Japan's Tokyo Electron; Tesla and SpaceX are also in talks with about 10 South Korean equipment makers, including Hanmi Semiconductor (advanced packaging equipment) and HPSP (high-pressure hydrogen annealing equipment). Musk also outlined AI compute goals: 2.5 to 3 GW of computing capacity active by the end of 2026, a total of 13 GW by the end of 2027, and plans to bring a 440,000-GPU Nvidia 'Vera Rubin' training cluster online by the end of Q2 2027. The event remains a plan/target and volume production has not been achieved.
EUV lithography systemslogic chipsmemoryASML, Tesla and 11 totalTom's HardwareCapacity Change

Analog	$0.68	−5.9%
Connector	$0.75	+0.2%
CPU	$386.74	−21.3%
DDR4	$88.40	−0.2%
DDR52026-W13	$14.89	−11.2%
GPU	$478.20	+8.2%
MCU	$0.68	−61.7%Unusual
MLCC	$0.01	+54.0%Unusual
MOSFET	$0.12	−82.8%Unusual
PMIC2026-W13	$0.44	−12.5%
SSD/HDD	$288.43	n/a

NuAxi Stream - Real-Time Semiconductor Intelligence

Mon, Oct 26

Intel Begins Equipment Installation at Arizona Fab 62, Targets Late 2028 Operations

Sun, Oct 25

Magnate Technology sees aerospace, semiconductor growth opportunities

Fri, Oct 23

Micron's next-generation 3D NAND to double bit density with over 400 layers, offering extreme performance

MicroVision Begins Commercial Production of MOVIA(TM) Pro for Superior Short-Range Sensing and Onboard Perception, Enabling Physical AI at the Edge

YMTC to Start Mass Production of LPDDR5X with 9,600 MT/s Speed

Tesla, Nvidia reportedly invest KRW3.7 trillion to secure Samsung Electro-Mechanics ABF capacity

Western Digital bets on pricing and HAMR, not new capacity, as Toshiba plans to double output

Unitree's cumulative G1 humanoid robot output reaches 10,000–20,000 units

PSMC eyes Taiwan, Japan, Singapore for 3D AI foundry expansion

Daeduck Electronics Adds 615 Billion Won Investment

LG Display Plans to Restart Idle OLED Capacity

Intel Fab 62 Moves to Next Phase, Begins Equipment Installation

Thu, Oct 22

Semtech secures dedicated SiGe capacity at Tower

Hana Technology to Ship Battery Equipment to India’s Agratas in November

Nvidia Invests in AI Supply Chain to Expand Production Capacity

#TrendForce notes that #Micron plans to begin mass producing its 1-delta nm process in 2027, which is set to succeed its current mainstream 1-gamma nm...

Samsung Electro-Mechanics, Nvidia to Expand FC-BGA Production

Intel installs production tools at Fab 62 in Arizona, provides updates on Ohio chip fab

(PR) NVIDIA and Supply Chain Partners Expand Capacity to Accelerate AI Infrastructure Buildout

Wed, Oct 21

ASML and other critical semiconductor equipment suppliers expedite shipments to Musk's Terafab

Chip Teardown Lab2 opened

Component price indexNPI, vs. prior period

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