Daeduck Electronics Adds 615 Billion Won Investment

What happened

Daeduck Electronics said in a regulatory filing on Oct. 22 that it will invest an additional 615 billion won in semiconductor production equipment and ancillary facilities to expand semiconductor substrate production capacity. The amount represents 68.54% of its consolidated equity at the end of 2025, the investment will run through Dec. 31, 2030, and it will be financed through existing funds and external borrowing. The announcement comes three months after the company unveiled a 497 billion won investment in July; the three new facility investments disclosed in 2026 total 1.325 trillion won. In May, the company unveiled a 213 billion won investment to establish a flip-chip chip-scale package (FC-CSP) production plant at its B1 Center in Siheung, Gyeonggi Province; in July, it announced another 497 billion won investment to expand production of flip-chip ball grid array (FC-BGA), FC-CSP and memory substrates, with both projects scheduled for completion by the end of 2027. In July, it also acquired Newflex's Ansan factory for 52.8 billion won, an acquisition separate from the disclosed investments in new facilities. Daeduck Electronics has been negotiating long-term agreements (LTAs) with several global technology companies for FC-BGA, FC-CSP and memory substrates, and is expanding capacity using advance payments received from customers. In its filing, the company said the investment is intended to expand production equipment and ancillary facilities to meet growing demand in the semiconductor market.

Impact and signal

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Source and time

Source: The Elec · 10/22/2026 · View original source