Skip to main content

NuAxiSemiconductor trade intelligence

Samsung expands HBM packaging at Onyang as Cheonan runs short of space

What happened

Samsung Electronics is expanding its high-bandwidth memory (HBM) packaging operations in South Korea as its Cheonan campus runs short of space, prompting the company to develop nearby Onyang into another major production base for advanced AI memory. The expansion is in a planned/underway stage; the source does not specify timing, capacity figures or investment amounts.

Impact and signal

Medium impactImpact score: 60/100

Affected components and suppliers

Samsung Electronics

HBMpackagingcapacity_expansionSamsungOnyangCheonan

Source and time

Source: DigiTimes Asia · 11/12/2026 · View original source

Open the NuAxi live feed →

Real-time pricing, supply signals and AI analysis for semiconductor traders

Advanced logic processes are becoming increasingly important to the HBM supply chain as demand for customized HBM (cHBM) grows. Starting with the HBM4...TrendForce Official (Market Data) · 10/19/2026
Nvidia's custom HBM pulls Samsung onto TSMC's 3nm process, report saysDigiTimes Asia · 10/18/2026
[News] NVIDIA without Huang: New Tests Ahead as AMD Eyes Gains, TSMC Finds a Cushion and Memory Giants Weigh RisksTrendForce · 11/12/2026
Elon Musk calls out memory makers over 'extortionate' chip pricing, says Micron is playing smart for long-term loyaltyTom's Hardware · 10/15/2026
Samsung and SK hynix warn AI-driven memory shortages could last until 2027 and beyond, as HBM demand explodes — customers already reserving supply years ahead, while the wider DRAM market begins to tightenTom's Hardware · 4/30/2026
HBM could take nearly 30% of DRAM wafer capacity next year, up from about 20% now, says #Samsung EVP Kim Taewoo. With #HBM and conventional #DRAM comp...TrendForce Official (Market Data) · 9/29/2026