NuAxiSemiconductor trade intelligence
RT NEWS: Taiwan’s #Winbond is reportedly targeting #EUV adoption for its 14nm DRAM by 2030! The memory chipmaker is working with #ASML, with its firs...
What happened
Reportedly, Taiwan memory chipmaker Winbond is targeting EUV adoption for its 14nm DRAM by 2030 and is working with ASML, with its first EUV tool potentially arriving in about two years. This is a reported plan/target, not a completed deployment; the linked article headline mentions 'Equipment Lead Times Stretch' as related context.
Impact and signal
Medium impactImpact score: 58/100
Affected components and suppliers
14nm DRAM
WinbondASML
EUV14nm DRAMWinbondASMLTrendForce设备交期
Source and time
Source: TrendForce Official (Market Data) · 11/10/2026 · View original source
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