[News] Samsung, SK hynix Reportedly Race for ASML EUV Amid 2027–2028 Shortages; Orders Worth Up to KRW 20T Each

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Samsung Electronics and SK hynix are reportedly stepping up efforts to secure ASML's EUV lithography equipment amid tightening supply and growing demand for advanced DRAM. According to Solution News, citing industry sources, the two companies are competing for ASML's EUV systems, with each reportedly committing between KRW 10 trillion and KRW 20 trillion. Equipment lead times have reportedly doubled, and both companies are considering placing future orders earlier than planned, with additional orders expected that could push capital expenditures higher. SK hynix disclosed an EUV equipment purchase worth approximately KRW 11.95 trillion, equivalent to 9.97% of its total assets at the end of 2024; the order, including installation and modification costs, is scheduled for delivery by December 31, 2027, supporting its transition to 1c DRAM, the sixth generation of 10nm-class DRAM. According to Financial News, Samsung is likewise expanding advanced DRAM capacity, adding 1c DRAM production lines for HBM4 at its Pyeongtaek P4 facility and advancing its P5 complex, where the first fab is targeted to begin operations in 2028; Solution News reports Samsung has already ordered lithography equipment for P5, with equipment move-in expected after the first-phase cleanroom is completed in the first half of 2027. According to The Bell, both companies are preparing to adopt High-NA EUV for next-generation DRAM, reportedly aiming to begin mass production of 1d DRAM in 2027 before moving to limited production of sub-10nm 0a DRAM in 2028; High-NA EUV is expected to be introduced at the 0a stage, initially for selected layers, with Samsung reportedly considering its use in just one or two layers to balance costs and yields. In its October earnings release, ASML warned that planned supply would fall short of demand in both 2027 and 2028, with some customers already expressing interest in placing orders for 2029 and even 2030; ASML is exploring ways to expand its 2028 production capacity beyond the previously considered 30% year-on-year increase. Its third-quarter earnings presentation showed memory customers accounted for 46% of net system sales, versus 54% for logic customers. According to Solution News, back-end equipment supply is also constrained, with order backlogs stretched to two to three years and Hanmi Semiconductor and Amkor reportedly nearing full order books; both are expanding capacity for AI data center-related equipment, including thermocompression (TC) bonders used in HBM manufacturing.

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Source: TrendForce · 11/9/2026 · View original source