[News] Winbond Reportedly Targets 2030 EUV Adoption for 14nm DRAM as Equipment Lead Times Stretch Beyond Two Years

What happened

According to MoneyDJ, Taiwanese memory chipmaker Winbond, a supplier of specialty DRAM and NOR flash, is advancing plans to adopt extreme ultraviolet (EUV) lithography. President Pei-Ming Chen said the company plans to develop two generations of 14nm technology, one without EUV and one incorporating EUV, with the latter targeted for introduction in 2030 if development proceeds smoothly; the stated reason is that EUV could reduce the multiple patterning steps required as circuit dimensions shrink, potentially shortening processing times and improving yields. Winbond has collaborated with ASML on EUV for approximately three and a half years, sending personnel for training, equipment trial runs and measurements; ASML has indicated that, based on current lead times, it could deliver Winbond's first EUV system in approximately two years, with subsequent systems taking around three and a half years. According to Nikkei, Chen said delivery times for some lithography and metrology tools now exceed two years, requiring orders well in advance amid competition from larger chipmakers such as TSMC; construction of the new Kaohsiung fab is set to begin in December, with limited capacity expected in 2029 and a more significant production ramp-up in 2030. Chairman Arthur Chiao said capacity expansion initiated in the second half of 2025 is already progressing, with additional output expected in 2027 and further increases in 2028, although growth will slow as cleanroom space reaches its limits. Chen said automotive memory accounts for approximately 3% to 4% of the global memory market and that demand visibility has improved as major suppliers reduce DDR3, DDR4 and LPDDR4 supply, prompting customers to seek long-term supply agreements; he expects memory prices to continue rising in the fourth quarter, supporting further revenue growth at Winbond, though at a slower pace than in previous quarters. Chiao cautioned that further price increases could weigh on consumer demand, as higher smartphone and PC prices could prompt consumers to delay upgrades, while noting AI demand remains strong enough to absorb higher memory prices and that data center installations planned for 2027 and 2028 are largely supported by earlier investment commitments, giving relatively clear visibility into DRAM demand, with supply depending on how quickly manufacturers expand capacity.

Impact and signal

Affected components and suppliers

Source and time

Source: TrendForce · 11/10/2026 · View original source