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Paras, BroadPak to develop advanced packaging facility in India

What happened

According to a PTI report, India's Paras Semiconductors, a subsidiary of Paras Defence and Space Technologies, has announced a technology partnership with US-based BroadPak Corporation to develop advanced semiconductor packaging capabilities in India. Through the partnership, Paras Semiconductors aims to set up an advanced heterogeneous integration and 3D packaging OSAT facility in India. The proposed unit will focus on 2.5D/3D packaging, chiplet integration, hybrid bonding, wafer-level and panel-level fan-out packaging, co-packaged optics, and testing and qualification. Munjal Sharad Shah, Managing Director of Paras Defence and Space Technologies, said the entry into the semiconductor sector represents a strategic expansion into a technology domain increasingly critical to India's AI, data centres and industrial capabilities. The facility remains at a proposed/planned stage and has not been built.

Impact and signal

Medium impactImpact score: 50/100

Affected components and suppliers

2.5D/3D packagingchiplet integrationhybrid bondingwafer-level fan-out packagingpanel-level fan-out packagingco-packaged optics
Paras SemiconductorsParas Defence and Space TechnologiesBroadPak Corporation
advanced packagingOSATIndiatechnology partnershipheterogeneous integration3D packaging

Source and time

Source: Evertiq · 11/9/2026 · View original source

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