[News] Samsung Reportedly Eyes Early 2027 for 3D Cube-H Advanced Packaging Development, Featuring Hybrid Bonding

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According to ZDNet citing industry sources, Samsung Electronics is accelerating advanced packaging efforts to strengthen its position in AI chip manufacturing, aiming to complete development of its next-generation 3D Cube-H technology by early 2027. The technology uses hybrid bonding to enable vertical stacking of logic chips, with an interconnect pitch of approximately 6 micrometers (μm), significantly finer than the minimum pitch of around 25μm for existing TC bonding-based chips. Samsung plans to complete its first design kit in early 2027, followed by evaluations with potential customers. The report notes successful development could strengthen Samsung's competitiveness in next-generation AI semiconductors and lay the groundwork for securing manufacturing orders from major technology companies. Potential applications include stacking high-performance logic chips such as GPUs, or integrating logic chips with memory devices such as HBM. However, according to ETNews, a Samsung packaging executive said at ISMP 2026 that controlling particle contamination and preventing void formation remain major hurdles. Separately, per Yonhap News, Chairman Jay Y. Lee visited the company's Advanced Package Lab (APL) in Yokohama, Japan, on November 1 to review packaging materials and process technologies; the facility officially opened in September and is part of a planned KRW 350 billion (US$262 million) investment over five years through 2028.

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Source: TrendForce · 11/10/2026 · View original source