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India's RRP Electronics opens advanced wafer-level packaging facility in Navi Mumbai
What happened
India's RRP Electronics has inaugurated an Advanced Wafer-Level Packaging (AWLP) facility at its semiconductor unit in Navi Mumbai, Maharashtra. According to Dalal Street Investment Journal, the facility opened on October 12, 2026. The facility adds SIM and eSIM module production and specialized testing to its outsourced semiconductor assembly and test (OSAT) operations. The source does not state the cause.
Impact and signal
Medium impactImpact score: 60/100
Affected components and suppliers
advanced wafer-level packaging (AWLP)SIM and eSIM modules
RRP Electronics
IndiaNavi MumbaiOSATadvanced wafer-level packagingfacility inaugurationSIM
Source and time
Source: DigiTimes Asia · 10/15/2026 · View original source
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