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Paras Semiconductors teams with US-based BroadPak on advanced packaging plant in India
What happened
Paras Semiconductors announced a strategic technology partnership with US-based BroadPak Corporation on November 6 to build advanced semiconductor packaging capabilities in India, anchored by a planned INR62 billion (US$658.77 million) OSAT facility in Madhya Pradesh.
Impact and signal
Medium impactImpact score: 60/100
Affected components and suppliers
OSAT facilityadvanced semiconductor packaging capabilities
Paras SemiconductorsBroadPak Corporation
OSATAdvanced PackagingIndiaPartnership
Source and time
Source: DigiTimes Asia · 11/8/2026 · View original source
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