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Infineon lays foundation of third wafer fab module in Kulim, Malaysia
What happened
Infineon has laid the foundation for a third wafer fab module in Kulim, Malaysia, representing an investment exceeding RM8bn. The expansion is targeted at increasing manufacturing capacity for power semiconductors, specifically silicon carbide (SiC) and gallium nitride (GaN) technologies. Bearish: This significant capacity addition, expected to be operational by Q3 2024, will increase future supply for key wide-bandgap components, potentially easing long-term pricing pressure.
Impact and signal
Medium impactImpact score: 60/100
Affected components and suppliers
SiC Power SemiconductorsGaN Power Semiconductors
capacity-expansionwide-bandgapcapex
Source and time
Source: Semiconductor Today · 7/13/2022 · View original source
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