[News] Intel-Backed Firm Breaks Ground on India’s 1st 3D Packaging Plant, Targeting ~70K Glass Substrates Annually
Intel-backed 3D Glass Solutions (3DGS) has broken ground on India's first advanced 3D packaging facility, targeting 69,600 glass panel substrates annually. The project, backed by Intel Capital and Lockheed Martin, aims to produce glass interposers and 3D heterogeneous integration modules for defense and AI applications.
This capacity expansion signals a shift in the advanced packaging supply chain but may introduce long-term price pressure.
- Related manufacturers
- 3D Glass Solutions, Intel, Lockheed Martin, Heterogeneous Integration Packaging Solutions
- Impact score
- 65 / 100, medium impact