Eternal Materials reported a 23.86% year-over-year revenue increase to NT$4.093 billion in July, driven by strong demand from the electronics supply chain and the start of the peak season. This growth reflects strengthening demand in advanced packaging sectors.
Samsung commercialized FOPLP first, but TSMC is pushing 310x310mm panel formats, threatening Samsung's lead in packaging technology.
South Korean DRAM export prices surged 401% year-on-year to $92,183 per kilogram in early August, while server DDR5 contract prices jumped 64% in the second half of 2025. This rally is driven by high-density product demand and capacity constraints, with projections for further increases of 13-18% in Q3 and 3-8% in Q4 2026. Bullish. The sustained price shock across global markets (US, Germany, Japan) confirms a severe shortage and strong demand for server memory.
Apple launches M6 (2nm) and M5 Ultra chips, validating TSMC's 2nm yields. Mac mini prices rise $100. TSMC and Foxconn benefit from supply chain validation.
Samsung introduced the industry's first LPDDR5X-PIM memory, achieving 3.01x faster AI inference speeds compared to standard LPDDR5X. This technology addresses the high cost of HBM by offering a cheaper in-memory processing alternative for AI workloads. Watch: Potential demand shift from HBM to LPDDR5X.
North American EMS bookings surged 44.3% YoY and 76% MoM in July, with a 3-month book-to-bill ratio of 1.29. Shipments lagged demand, falling 5.8% MoM, indicating a supply-demand imbalance. Bullish signal for semiconductor demand as order activity accelerates sharply.
The U.S. is negotiating with South Korea to secure billions of dollars in new investment from DRAM manufacturers on American soil. This move aims to address U.S. dissatisfaction with delays in Korean companies' expansion plans and supplements the $350 billion agreement reached last year. Traders should monitor the September announcement to assess the potential impact on capacity and pricing.
KYOCERA AVX and Mouser Electronics discuss the Anomalous Charging Current (ACC) in Polymer Tantalum Capacitors, its potential impact on switching power supplies and satellite power conversion, and KYOCERA AVX's solutions to mitigate the issue.
Coherent has initiated customer sampling of 300mm high-thermal-conductivity SiC substrates designed for AI and HPC thermal management. The substrates offer 25% improved heat spreading compared to current solutions. This milestone marks a transition from R&D to commercial evaluation, signaling future supply capabilities for advanced packaging.
EPC announced mass production of the EPC2370 GaN FET for AI power architectures, priced at $2.52 per unit. The device targets 6V high-current synchronous rectification in server power supplies. Bullish signal as supply ramps to meet growing AI computing demand.
Aratas America LLC launched the G3VH high-load-voltage SiC MOSFET relay, supporting 1,800V and 3,300V load voltages. The relay utilizes SiC technology for high voltage withstand capability and low on-resistance, targeting applications like semiconductor test equipment. Neutral signal.
BEL and Ananth Technologies signed an MoU to collaborate on the design and manufacturing of advanced electronic systems for defense and aerospace applications, including missiles and radars.
MacDermid Alpha is showcasing solder and sintering technologies designed to improve attach consistency in high-volume power electronics manufacturing. This highlights a focus on process optimization rather than immediate supply constraints. Neutral impact on current market pricing.
Samsung's zHBM reduces thermal resistance by 50% and increases density 10x, while liquid cooling penetration in AI chips is projected to rise to 60% by 2027. As 3D stacking exacerbates thermal challenges, the industry is shifting toward CPO and STCO solutions. Bullish for advanced packaging and cooling technologies.
TT Electronics has secured a multi-million pound lifetime contract with Rolls-Royce to supply mission-critical power electronics, including multi-chip power modules and precision magnetics, manufactured in the UK. This agreement extends a 40-year partnership and confirms long-term demand visibility for TT's specific power components. Bullish for TT Electronics' long-term revenue outlook.
SMIC posted record revenue of $3.01B and raised wafer prices for Q3, driven by 93.7% utilization and demand for AI logic chips and power management parts amid US export controls. The company is shifting from discounting to 'fairer pricing' to capture captive AI market share.
YMTC plans an A-share IPO to fund capacity expansion, surpassing Kioxia to become the world's third-largest NAND supplier. This move signals a shift from policy support to global competition. Bearish: Expansion plans suggest future supply increases.
SK hynix published a technology roadmap for co-packaged optics (CPO) in Nature Electronics, emphasizing the shift in AI competition towards system-level integration.
Samsung Electronics fully repaid a KRW20 trillion unsecured loan from Samsung Display in Q2 2026 ahead of schedule. This move was driven by AI-related demand lifting memory prices and strengthening the company's cash position.
Norwegian supplier Confidee reports standard FR-4 and copper-clad laminate shortages spreading from advanced materials, with lead times extending and pricing volatile through 2027.
Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.
iPhone DuoFirst-pass chip map: 12 modules, 37 checkable identifiers (31 A / 6 B) and 19 public MPNs (16 externally searchable); A20 Pro, C2, N1 and the power/RF chains are located, while the NAND brand stays unconfirmed.All teardowns| Analog | $0.68 | −5.9% |
|---|---|---|
| Connector | $0.75 | +0.2% |
| CPU | $386.74 | −21.3% |
| DDR4 | $88.40 | −0.2% |
| DDR52026-W13 | $14.89 | −11.2% |
| GPU | $478.20 | +8.2% |
| MCU | $0.68 | −61.7%Unusual |
| MLCC | $0.01 | +54.0%Unusual |
| MOSFET | $0.12 | −82.8%Unusual |
| PMIC2026-W13 | $0.44 | −12.5% |
| SSD/HDD | $288.43 | n/a |