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Coherent Samples 300mm SiC Substrates for AI Infrastructure

What happened

Coherent has initiated customer sampling of 300mm high-thermal-conductivity SiC substrates designed for AI and HPC thermal management. The substrates offer 25% improved heat spreading compared to current solutions. This milestone marks a transition from R&D to commercial evaluation, signaling future supply capabilities for advanced packaging.

Impact and signal

Low impactImpact score: 10/100

Affected components and suppliers

SiC Substrates300mm SiC Wafers

Coherent

SiCThermal ManagementAI300mm

Source and time

Source: Power Electronics News · 8/24/2026 · View original source

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Coherent Samples 300mm SiC Substrates for AI Infrastructure

What happened

Impact and signal

Affected components and suppliers

Source and time

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