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NuAxiSemiconductor trade intelligence

TSMC's 310mm push threatens Samsung's PLP lead

What happened

Samsung commercialized FOPLP first, but TSMC is pushing 310x310mm panel formats, threatening Samsung's lead in packaging technology.

Impact and signal

Medium impactImpact score: 40/100

Affected components and suppliers

PLPFOPLP

Samsung Electronics TSMC

PLPFOPLP310mm封装产能

Source and time

Source: DigiTimes Asia · 8/25/2026 · View original source

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