NuAxiSemiconductor trade intelligence

[News] Chip Packaging Experts Flag Heat as AI’s Biggest Bottleneck; AI-Driven Design, CPO and STCO May Help

What happened

Samsung's zHBM reduces thermal resistance by 50% and increases density 10x, while liquid cooling penetration in AI chips is projected to rise to 60% by 2027. As 3D stacking exacerbates thermal challenges, the industry is shifting toward CPO and STCO solutions. Bullish for advanced packaging and cooling technologies.

Impact and signal

Medium impactImpact score: 65/100

Affected components and suppliers

HBM DRAMNAND FlashSRAMCPOSTCO

Samsung Electronics NVIDIA AMD GoogleKAISTSeoul National University of Science and Technology

thermal_managementadvanced_packagingliquid_coolingmemory_density

Source and time

Source: TrendForce · 8/20/2026 · View original source

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[News] Chip Packaging Experts Flag Heat as AI’s Biggest Bottleneck; AI-Driven Design, CPO and STCO May Help

What happened

Impact and signal

Affected components and suppliers

Source and time

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