Huawei targets 1.4nm equivalent density by 2031 using 'Logic Folding' technology, aiming to close the gap with TSMC without EUV. This long-term R&D roadmap focuses on circuit architecture optimization rather than immediate supply chain shifts.
Windows on Arm (WoA) market share has stagnated at 4-6% over the past two years, failing to meet Qualcomm's 50% projection. WoA faces challenges in the mainstream $599 segment and struggles with gaming/creation workloads, while x86 (Intel Lunar Lake, AMD Strix Point) maintains efficiency and performance advantages. Bearish for Arm PC adoption; x86 ecosystem retains dominance in the PC market.
Huawei launched 61.44TB and 122.88TB SSDs using Die-on-Board (DoB) packaging to bypass US sanctions on high-layer 3D NAND. This workaround allows the company to use YMTC's Xtacking 4.0 dies more densely on the PCB. Neutral: While this mitigates sanctions impact on capacity, thermal and signal integrity challenges remain.
AMD CEO Lisa Su announced plans to invest over $10 billion in Taiwan's industrial ecosystem to accelerate AI infrastructure development. She shared latest progress on collaborations with TSMC regarding backend packaging, substrates, and AI server supply chains. Bullish outlook for AMD and TSMC's AI chip demand and supply chain cooperation.
NVIDIA reported record earnings but conceded the China market to Huawei, while targeting $20 billion in CPU revenue by 2026 through its Vera platform.
Semidynamics secured strategic investment to accelerate development of memory-centric AI inference chips, targeting high performance-per-watt for edge and data center applications.
Microsoft launches Surface Pro 12th Edition and Surface Laptop 8th Edition starting at $1,499, featuring Intel Core Ultra processors for enterprise AI workloads.
ETH Zurich researchers discovered a 100% success rate vulnerability in AMD EPYC that allows memory read access via Infinity Fabric. The exploit bypasses SEV-SNP confidential computing protections without physical access or code execution. Bearish impact on AMD EPYC demand as cloud providers reassess security trust.
Itron has completed a smart water management project in Thane, India, deploying its MDM solution and smart water meters in collaboration with Ceinsys Tech Ltd. The project aims to enhance water conservation and billing accuracy. Bullish for Itron's smart water metering segment.
Microchip Technology has launched the EX-423 Evacuated Miniature Crystal Oscillator (EMXO) for power-constrained applications. The device features ultra-low phase noise and operates at 10-20MHz with a rugged 13mm x 13mm package. It is now available for purchase.
Europe's sovereign cloud initiatives, funded with over €2 billion, rely on Intel and AMD processors. These processors contain management engines (ME/PSP) that operate at Ring -3 and are subject to US law. Bearish for Intel/AMD in the EU sovereign market due to security and sovereignty risks.
March semiconductor sales surged 88.1% YoY, driven by Memory (+269.1%) and Logic (+38.9%) due to AI datacenter demand. However, unit growth is only 9.9%, indicating the boom is fueled by ASPs rather than real demand. Bearish outlook: ASPs will crash and the memory market will collapse once new capacity comes online.
Altech Corporation launches a new line of smart relays and multi-timers featuring modular scalability up to 48 I/Os, Modbus communication, and free configuration software for industrial automation applications.
Farnell announced immediate availability of Microchip's new PIC32CM PL10 MCUs, featuring Arm Cortex-M0+ cores and 5V operation. These devices target industrial and consumer applications, offering pin-to-pin compatibility for 8-bit upgrades. The launch represents a neutral market impact as it introduces a new product without immediate supply constraints.
Tower Semiconductor secured $1.3bn in silicon photonics contracts for 2027 revenue and received $290m in prepayments for capacity reservation. This indicates strong demand for SiPho capacity and tight supply outlook.
CAST introduces a configurable xSPI-MC IP core supporting HyperBus and Xccela interfaces with functional safety features, addressing protocol fragmentation.
64Gb MLC NAND spot prices have surged over 300% since late 2025, recently trading in the $20-$28 range, driven by Samsung and Kioxia exiting legacy 2D NAND production to focus on HBM and advanced 3D NAND.
Vishay Intertechnology's VETH100A1DD1 ESD protection diode passed IEEE 10BASE-T1S compliance tests, offering low capacitance (<1 pF) for automotive One-Pair Ethernet applications.
SMIC founder Richard Chang notes that 80% of semiconductor demand lies outside advanced nodes, favoring niche markets. TrendForce reports customers in HV processes and CIS are migrating to Chinese foundries since H2 2025 due to Taiwanese capacity shifts and price hikes. Bullish for SMIC's mature node capacity and pricing as demand for 90nm+ wafers surges.
Scintil Photonics CEO Matt Crowley confirms the production of LEAF Light, a DWDM laser source for AI networks, utilizing Tower Semiconductor's silicon photonics line. The company addresses AI infrastructure bottlenecks through its SHIP technology, which integrates III-V materials onto silicon wafers. This production milestone and NVIDIA's participation signal a bullish outlook for AI optical components.
Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.
iPhone DuoFirst-pass chip map: 12 modules, 37 checkable identifiers (31 A / 6 B) and 19 public MPNs (16 externally searchable); A20 Pro, C2, N1 and the power/RF chains are located, while the NAND brand stays unconfirmed.All teardowns| Analog | $0.68 | −5.9% |
|---|---|---|
| Connector | $0.75 | +0.2% |
| CPU | $386.74 | −21.3% |
| DDR4 | $88.40 | −0.2% |
| DDR52026-W13 | $14.89 | −11.2% |
| GPU | $478.20 | +8.2% |
| MCU | $0.68 | −61.7%Unusual |
| MLCC | $0.01 | +54.0%Unusual |
| MOSFET | $0.12 | −82.8%Unusual |
| PMIC2026-W13 | $0.44 | −12.5% |
| SSD/HDD | $288.43 | n/a |