NuAxi Stream - Real-Time Semiconductor Intelligence

Thu, May 28

22:47Impact score 15
Samsung opens door to 900-layer 3D NAND
Samsung has developed a 900-layer 3D NAND die by stacking two 450-layer strings, significantly outpacing competitors who are currently at 192-321 layers. This R&D milestone, coming alongside plans for 400-layer mass production this year, indicates a major leap in density.
利空
The technology gap suggests future cost reductions and capacity increases, pressuring competitors to accelerate their own roadmap.
NAND FlashSamsung ElectronicsBlocks & FilesTechnical
13:48Impact score 25
Solidigm appoints co-CEOs to split operations and growth responsibilities
Solidigm, a SK Hynix subsidiary, appointed two co-CEOs to split operations and growth responsibilities, aiming to accelerate execution amid rising AI-driven storage demand. The leadership reshuffle targets improved business performance and product delivery speed.
NAND FlashEnterprise SSDSolidigm, SK HynixDigiTimes AsiaPartnership/M&A

Tue, May 26

18:57Impact score 5
Angry TSMC employees considering strikes, unionization over employee bonuses, report claims — company reportedly considering 15% payout cut to fund capex despite record revenues fuelled by AI surge
TSMC employees are considering strikes and unionization amid rumors of a 15% bonus cut, despite record profits and massive capex spending. TSMC denies the cut, stating bonuses will grow in 2026. This internal labor dispute is a background risk factor rather than a direct supply chain disruption.
TSMC, Samsung Electronics and 3 totalTom's HardwareFinancial/Earnings
09:53Impact score 25
RT NEWS: 💥#SKhynix is adding another tool to tackle #HBM thermal challenges. With its iHBM solution set for HBM5, the memory giant embeds cooling e...
SK hynix introduces iHBM solution for HBM5, embedding cooling elements to reduce thermal resistance by 30%, addressing thermal bottlenecks.
HBM5HBMSK hynixTrendForce Official (Market Data)Product Launch
08:13Impact score 35
SK hynix unveils ‘iHBM’ thermal solution to boost AI performance
SK hynix launches iHBM thermal solution integrating ICEs into HBM packages, reducing thermal resistance by 30% to address heat management in high-power AI applications.
HBMSK hynixSK Hynix NewsroomProduct Launch
01:45Impact score 15
[News] SK hynix Introduces iHBM Solution, Targets HBM5 Adoption with 30% Thermal Resistance Reduction
SK hynix unveiled its iHBM solution, integrating cooling elements to reduce thermal resistance by 30% for HBM5. This addresses thermal bottlenecks in high-stack HBM using WLP and MR-MUF processes. Bullish: The technology enhances HBM5 stability for AI data centers, strengthening SK hynix's competitive edge.
HBM5HBMiHBMSK hynixTrendForceProduct Launch

Mon, May 25

13:03Impact score 90
Nvidia's Vera CPU push lifts LPDDR outlook for Samsung, SK Hynix
Nvidia's standalone Vera CPU launch is driving new demand for low-power DRAM, specifically benefiting Samsung Electronics and SK Hynix amidst an already constrained supply chain.
LPDDRLow-power DRAMSamsung Electronics, SK HynixDigiTimes AsiaShortage Alert

Sat, May 23

20:00Impact score 90
Micron's Virginia fab begins producing America's most advanced DRAM memory — fab expansion to quadruple output, easing DDR4 shortage for automotive and defense sectors
Micron began producing 1α DRAM at its Virginia fab, quadrupling DDR4 output. As major producers shift capacity to DDR5 and HBM, automotive DRAM prices are projected to surge 70-100% in 2026, with inventory buffers dropping to 6-8 weeks. Bullish for automotive DRAM prices.
DDR4DRAMAutomotive DRAMMicron TechnologyTom's HardwareShortage Alert
19:40Impact score 20
Huawei develops 122TB SSD with new packaging tech to sidestep US sanctions on 3D NAND chips — Chinese firm develops proprietary tech to cram more NAND dies in a smaller footprint
Huawei launched 61.44TB and 122.88TB SSDs using Die-on-Board (DoB) packaging to bypass US sanctions on high-layer 3D NAND. This workaround allows the company to use YMTC's Xtacking 4.0 dies more densely on the PCB. Neutral: While this mitigates sanctions impact on capacity, thermal and signal integrity challenges remain.
SSDNAND Flash3D NANDHuawei, Samsung Electronics and 4 totalTom's HardwareProduct Launch
11:35Impact score 0
SK Hynix weighs opening Seoul office at SK Group headquarters
SK Hynix is considering opening a sales office near the SK Group headquarters. This is an internal organizational adjustment with no impact on supply chain or pricing.
SK HynixDigiTimes AsiaPartnership/M&A

Wed, May 20

03:38Impact score 65
[News] ASML Expects First High-NA EUV Memory, Logic Products Within Months Amid TSMC’s Cost-Driven Delay
ASML CEO expects first High-NA EUV products within months, while TSMC delays adoption due to high costs. Intel and SK hynix are aggressively deploying the technology, whereas Samsung adopts a pragmatic approach.
High-NA EUV Lithography EquipmentASML, TSMC and 5 totalTrendForceCapacity Change

Tue, May 19

06:34Impact score 15
[News] SCHMID Flags TSMC Panel-Level Packaging Push: 310×310mm Progress, Glass Integration Under Review
SCHMID forecasts the panel-level packaging market to expand 3-4x by 2030, with TSMC advancing its CoPoS platform and glass integration for mass production by 2028. This shift towards glass substrates and standardized panel sizes is driven by major OEMs like Intel and Samsung to overcome organic substrate limitations.
Glass SubstratesPanel-Level PackagingIC SubstratesSCHMID, TSMC and 8 totalTrendForceCapacity Change

Mon, May 18

03:44Impact score 65
[News] TSMC Targets 2H26 COUPE on Substrate; NVIDIA Could Eye Long-Term Substrate Deals Amid CPO Push
TSMC targets 2H26 mass production for COUPE on Substrate, while NVIDIA seeks long-term substrate deals to secure capacity for AI chips. This move aims to prevent supply constraints similar to previous CoWoS and HBM shortages. The demand surge for AI GPUs and CPO is expected to tighten high-end ABF substrate supply by 2027.
ABF SubstratesHigh-end SubstratesOptical ModulesTSMC, NVIDIA and 5 totalTrendForceShortage Alert

Sat, May 16

00:32Impact score 92
Samsung Starts Shutting Down Chip Production Lines Ahead of 18-Day Worker Strike
Samsung Electronics is curtailing production of HBM, (LP)DDR5, and custom logic due to an 18-day strike involving over 43,000 workers. TrendForce estimates this will disrupt 3-4% of global DRAM and 3% of NAND supply during a critical shortage period.
DRAMNAND FlashHBMSamsung ElectronicsTechPowerUpShortage Alert

Thu, May 14

22:21Impact score 25
Kioxia and Dell cram 10 PB into slim 2RU server
Dell and Kioxia have deployed a 9.8 PB all-flash storage server using 40 units of Kioxia's 245.76 TB LC9 QLC SSDs. This configuration targets AI infrastructure needs for high density and power efficiency. The launch highlights the industry trend toward 256 TB-class SSDs from major manufacturers like Micron and SK Hynix.
NAND FlashNVMe SSDsQLC SSDKioxia Corporation, Dell Technologies and 6 totalBlocks & FilesProduct Launch
16:00Impact score 90
Samsung wage talks collapse with strike deadline one week away
Samsung wage talks collapsed, threatening an 18-day strike starting May 21. The union demands bonus scheme reforms. This poses a significant supply risk to the semiconductor sector, which accounts for 37% of South Korea's exports.
Samsung SemiconductorMemory ChipsSamsung ElectronicsEvertiqShortage Alert

Wed, May 13

23:37Impact score 60
Japanese chemical giant JSR expands to Taiwan for EUV photoresist production near TSMC — plant to fill missing chemical link to scale EUV materials
JSR established a joint venture in Taiwan to build a photoresist plant expected to come online in 2028, filling a critical supply chain gap for TSMC's advanced nodes. This move consolidates JSR's position as the last of Japan's major EUV suppliers to have a local manufacturing base. Watch: The capacity expansion aims to secure supply for 2nm and below, potentially stabilizing the advanced photoresist market.
EUV PhotoresistPhotoresistJSR, TSMC and 4 totalTom's HardwareCapacity Change
23:30Impact score 65
[News] SK hynix CEO Reportedly to Meet Bill Gates, Deepening AI Memory Ties Amid Microsoft ASIC Push
SK hynix CEO met Microsoft executives to deepen AI memory ties, as Microsoft expands Maia 200 deployment and raises 2026 CapEx to $190 billion, driving demand for HBM3e.
HBM3eSK hynix, MicrosoftTrendForcePartnership/M&A
03:20Impact score 95
[News] Snapdragon 8 Elite Gen 6 Pro Reportedly Priced Above US$300 on TSMC 2nm, Risking Adoption
Qualcomm's Snapdragon 8 Elite Gen 6 Pro SoC is reportedly priced above $300 due to TSMC's 2nm process costs. The total bill of materials with LPDDR6 and UFS 5.0 exceeds $600, pressuring smartphone margins. Bullish for Qualcomm pricing, bearish for OEM margins.
Snapdragon 8 Elite Gen 6 ProSoCQualcomm, TSMC and 3 totalTrendForcePrice Movement
02:35Impact score 95
[News] MLC NAND Spot Prices Reportedly Triple Since Late 2025 as Samsung, Kioxia Exit Supply
64Gb MLC NAND spot prices have surged over 300% since late 2025, recently trading in the $20-$28 range, driven by Samsung and Kioxia exiting legacy 2D NAND production to focus on HBM and advanced 3D NAND.
MLC NAND2D NANDSamsung Electronics, Kioxia and 4 totalTrendForceShortage Alert

Analog	$0.68	−5.9%
Connector	$0.75	+0.2%
CPU	$386.74	−21.3%
DDR4	$88.40	−0.2%
DDR52026-W13	$14.89	−11.2%
GPU	$478.20	+8.2%
MCU	$0.68	−61.7%Unusual
MLCC	$0.01	+54.0%Unusual
MOSFET	$0.12	−82.8%Unusual
PMIC2026-W13	$0.44	−12.5%
SSD/HDD	$288.43	n/a

NuAxi Stream - Real-Time Semiconductor Intelligence

Thu, May 28

Samsung opens door to 900-layer 3D NAND

Solidigm appoints co-CEOs to split operations and growth responsibilities

Tue, May 26

Angry TSMC employees considering strikes, unionization over employee bonuses, report claims — company reportedly considering 15% payout cut to fund capex despite record revenues fuelled by AI surge

RT NEWS: 💥#SKhynix is adding another tool to tackle #HBM thermal challenges. With its iHBM solution set for HBM5, the memory giant embeds cooling e...

SK hynix unveils ‘iHBM’ thermal solution to boost AI performance

[News] SK hynix Introduces iHBM Solution, Targets HBM5 Adoption with 30% Thermal Resistance Reduction

Mon, May 25

Nvidia's Vera CPU push lifts LPDDR outlook for Samsung, SK Hynix

Sat, May 23

Micron's Virginia fab begins producing America's most advanced DRAM memory — fab expansion to quadruple output, easing DDR4 shortage for automotive and defense sectors

Huawei develops 122TB SSD with new packaging tech to sidestep US sanctions on 3D NAND chips — Chinese firm develops proprietary tech to cram more NAND dies in a smaller footprint

SK Hynix weighs opening Seoul office at SK Group headquarters

Wed, May 20

[News] ASML Expects First High-NA EUV Memory, Logic Products Within Months Amid TSMC’s Cost-Driven Delay

Tue, May 19

[News] SCHMID Flags TSMC Panel-Level Packaging Push: 310×310mm Progress, Glass Integration Under Review

Mon, May 18

[News] TSMC Targets 2H26 COUPE on Substrate; NVIDIA Could Eye Long-Term Substrate Deals Amid CPO Push

Sat, May 16

Samsung Starts Shutting Down Chip Production Lines Ahead of 18-Day Worker Strike

Thu, May 14

Kioxia and Dell cram 10 PB into slim 2RU server

Samsung wage talks collapse with strike deadline one week away

Wed, May 13

Japanese chemical giant JSR expands to Taiwan for EUV photoresist production near TSMC — plant to fill missing chemical link to scale EUV materials

[News] SK hynix CEO Reportedly to Meet Bill Gates, Deepening AI Memory Ties Amid Microsoft ASIC Push

[News] Snapdragon 8 Elite Gen 6 Pro Reportedly Priced Above US$300 on TSMC 2nm, Risking Adoption

[News] MLC NAND Spot Prices Reportedly Triple Since Late 2025 as Samsung, Kioxia Exit Supply

Chip Teardown Lab2 opened

Component price indexNPI, vs. prior period

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