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[News] SCHMID Flags TSMC Panel-Level Packaging Push: 310×310mm Progress, Glass Integration Under Review
What happened
SCHMID forecasts the panel-level packaging market to expand 3-4x by 2030, with TSMC advancing its CoPoS platform and glass integration for mass production by 2028. This shift towards glass substrates and standardized panel sizes is driven by major OEMs like Intel and Samsung to overcome organic substrate limitations.
Impact and signal
Low impactImpact score: 15/100
Affected components and suppliers
Glass SubstratesPanel-Level PackagingIC Substrates
capacity_expansionglass_substratepanel_level_packaging
Source and time
Source: TrendForce · 5/18/2026 · View original source
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