Connector manufacturer HARTING has joined the NVIDIA MGX ecosystem as a power connectivity supplier for the NVIDIA Vera Rubin NVL72 platform. The German connector manufacturer is providing high-current power cable assemblies designed to support the transition from 480 VAC distribution to 800 VDC architectures in AI data centres. The source does not state the cause beyond the stated facts.
high-current power cable assemblies800 VDC power connectivityHARTING, NVIDIAeeNews EuropePartnership/M&A
An industry article on evolving electronics procurement states that the electronica 2026 fair ranks among the world's leading electronics trade shows, and that the event will take place in Munich, Germany, from November 10 to 13, 2026. The article says supply chain management now matters as much as technology breakthroughs and that the event will gather firms and experts. No specific components, manufacturers, prices, or supply/demand figures are given, and the source does not state the cause.
US semiconductor ion implantation equipment maker Axcelis held a groundbreaking ceremony on Oct. 20 for its new Axcelis Asia Operations Center (AAOC) facility in the Oseong Industrial Complex in Pyeongtaek, Gyeonggi Province, South Korea, planning to expand its Pyeongtaek operations into an Asian manufacturing hub. The new facility will occupy a site of approximately 22,314 square meters with a building footprint of about 15,537 square meters, and its total floor area will be roughly five times that of the existing manufacturing facility, including equipment manufacturing facilities, warehouses, cleanrooms and a training center. Construction is expected to take about 18 months, with full operations scheduled to begin in the second half of 2028, at a total investment of approximately $35 million. The plant will primarily manufacture ion implantation equipment used in front-end semiconductor processing and will adopt lean manufacturing methods. AAOC is Axcelis' only manufacturing facility outside the United States; the company established it in 2021, began producing and shipping equipment in the second half of 2022, when the factory covered approximately 3,967 square meters with production capacity equivalent to about 20% of its US headquarters operations and 60% of output exported. Axcelis Korea's headcount has grown from 120 employees in 2022 to approximately 200 currently, with plans to increase to about 300 over the medium to long term. In September, Axcelis previously held an investment declaration ceremony with officials from South Korea's Ministry of Trade, Industry and Resources in Washington, D.C.
ion implantation equipmentAxcelisThe ElecCapacity Change
According to an analysis by Chinese semiconductor news outlet ijiwei, based on data from Japanese market research firm Techno Systems Research (TSR), OmniVision captured 13% of the global CMOS image sensor (CIS) market by revenue in 2025, surpassing Samsung Electronics' 12.8% share for the first time to become the world's second-largest CIS supplier; Sony retained the top position with a 54% share. OmniVision's CIS revenue totaled approximately $3 billion in 2025; per market research firm Yole, the global CIS market reached $25.3 billion in 2025, up 9% from 2024. ijiwei attributed the ranking change to a pullback by South Korean memory chipmakers: Samsung Electronics has shifted its focus toward high-bandwidth memory (HBM), while SK hynix has effectively exited the CIS market — SK hynix withdrew in March 2025, reassigning CIS personnel to AI memory operations including HBM. Onsemi's market share was below 3%. Samsung Electronics is reportedly seeking a rebound by securing Apple as a new customer, and is reportedly preparing to produce three-layer stacked CIS chips using hybrid bonding technology for a new iPhone series at its Austin, Texas, plant starting in 2026; Apple has previously sourced all CIS chips for its iPhones from Sony.
CMOS image sensors (CIS)OmniVision, Samsung Electronics and 5 totalThe Elec
Related manufacturers
OmniVision, Samsung Electronics, Sony, SK hynix, Onsemi
UK electronics manufacturer TechPoint has acquired Esprit Electronics, an EMS provider based in Southampton. All 92 Esprit employees join the TechPoint Group, and the company will keep operating from its current facilities. Esprit Electronics was founded in 1985 and serves multinational industrial customers with manufacturing and test services, and also designs and manufactures custom filtered connectors for electromagnetic compatibility (EMC, EMI and RFI) and transient voltage suppression (TVS), including lightning protection. Esprit says it will continue to offer EMS, supply chain services, design support (DFM, DFT and DFX) and logistics. According to TechPoint, the acquisition gives customers of both companies more manufacturing capacity, access to specialist automation and engineering expertise, and a more resilient supply chain. The companies have not disclosed the purchase price.
According to the source, Samsung Electronics is expected to enter 2027 with approximately 80% of its planned memory production secured under long-term contracts, reinforcing its pricing position; this is an expectation, not an achieved result. Meanwhile, China's ChangXin Memory Technologies (CXMT) is expanding capacity and attracting attention from US tech companies seeking alternative DRAM suppliers. The source headline also references Samsung's HBM4 supply lock-in and that Apple and Tesla seek DRAM alternatives. The source does not state the cause.
South Korean substrate maker Daeduck Electronics is accelerating development of ceramic core substrates (CCS) to address warpage and thermal-management challenges as AI semiconductor packages grow larger. The company is currently conducting performance and internal reliability assessments, plans to advance samples and customer evaluations in 2027 and 2028, and is targeting mass production in 2029; ceramic cores are positioned as a material alternative to glass cores for next-generation large-area packages. These remain plans/targets, with mass production not yet achieved.
Powertip Technology is transitioning from a module design and supply company into a solutions provider. The company stated that it has seen rising demand in the first half of 2026 while the electronics and manufacturing industries faced higher material costs, which it aims to control by negotiating price adjustments with its customers. It noted that such negotiations are difficult due to intense market competition, and that failure to deal with the situation properly could impact future operations; the company also said similar circumstances previously occurred during the pandemic.
TrendForce indicates that advanced logic processes are becoming increasingly important to the HBM supply chain as demand for customized HBM (cHBM) grows; starting with the HBM4e generation, all HBM base dies are expected to adopt advanced logic processes, with cHBM base dies potentially using 4nm or more advanced nodes. NVIDIA's NVHBM is expected to be adopted in HBM4e and subsequent generations to support next-generation AI chips scheduled to enter volume production from 2028 onward, and NVHBM base dies are expected to rely primarily on TSMC's advanced processes. As base dies become more valuable, collaboration between HBM suppliers and foundries is expected to deepen, extending HBM competition beyond core dies to encompass access to advanced logic capacity. Separately, Semiconductor Insider exclusively reported on Oct 18 that Samsung Electronics is to develop 'Next-Generation HBM' with TSMC; the tweet was posted on Oct 20, 2026.
HBMcHBMHBM4eNVIDIA, TSMC and 3 totalTrendForce Official (Market Data)
Gaonchips said on Oct. 19 that it will participate in the development of an artificial intelligence (AI) semiconductor for next-generation unmanned systems operated by Korea Aerospace Industries (KAI). Gaonchips will serve as a joint research and development partner in an aerial unmanned platform project overseen by KAI under the K-On-Device AI Semiconductor Technology Development Project, supported by the Ministry of Trade, Industry and Resources (MOTIR), with Supergate as the lead developer. The project aims to develop an AI system-on-chip (SoC) to serve as the brain of next-generation expendable unmanned aerial vehicles, enabling drones to run AI and carry out missions independently through on-device processing even where communications are disrupted or limited. Gaonchips will implement a domestically developed neural processing unit (NPU) and radar signal processing technology using Samsung Electronics' 8nm foundry process, and will handle physical design and final design verification of the entire chip; KAI will be responsible for system integration and verification of the unmanned platform, and Supergate will lead AI chip architecture design and software development. Gaonchips has experience developing and mass-producing 5nm on-device AI semiconductors and has worked on a 2nm GAA process and 2.5D packaging AI accelerator design project for a Japanese customer. The announcement describes a development project; no production or commercialization results are reported.
AI SoC (AI system-on-chip)neural processing unit (NPU)Gaonchips, Korea Aerospace Industries (KAI) and 4 totalThe ElecPartnership/M&A
Related manufacturers
Gaonchips, Korea Aerospace Industries (KAI), Supergate, Samsung Electronics
Nvidia's South Korea representative, Soyoung Jeong, said at KES 2026 that the company's Vera CPU already has customers in South Korea, and that the collaboration with LG Electronics on humanoid robots is expected to deliver results soon (an expectation stated by the source, with results not yet delivered). She also outlined Nvidia's role in the shift toward AI agents and physical AI. The source provides no specific figures on pricing, capacity or demand.
Citing IFA's CEO, the source states that sluggish demand in the European consumer electronics and home appliance markets in recent years, combined with overcapacity built during the pandemic, has dealt European manufacturers a double blow of falling demand and excess supply. Chinese competitors, leveraging rapid product development cycles and aggressive pricing, are aggressively seizing market share. This has placed severe operational pressure on European appliance makers such as BSH, which produces Bosch and Siemens appliances, and Miele, forcing some into plant closures. No specific price or volume figures are provided in the source.
According to commentary, Samsung Electronics' 2nm mass-production capability at its Taylor, Texas fab has become critical to its efforts to close the gap with TSMC, while Tesla's AI5 chip delivery schedule and Broadcom's potential 2nm orders hang in the balance. The company's ability to achieve competitive yields and stable output at the US facility will determine whether it can turn major customer orders into a broader foundry comeback. The source does not state the cause, and these statements are commentary rather than realized yield or order outcomes.
2nm processSamsung Electronics, TSMC and 4 totalDigiTimes AsiaCapacity Change
According to South Korea's Ministry of Trade, Industry and Resources, Samsung Electronics has transferred 126 of its mobile, display, and home appliance technologies free of charge to 99 small and midsize companies this year, with mobile technologies making up the bulk of the handover. The ministry hosted the 2026 technology-sharing event with Samsung at L Tower in Seoul's Yangjae-dong on October 19, 2026.
mobile technologiesdisplay technologieshome appliance technologiesSamsung ElectronicsDigiTimes Asia
According to officials and business leaders speaking at a seminar in Taipei on October 19, Taiwanese electronics makers are deepening their presence in Mexico's Chihuahua state, drawn by surging US demand for AI servers. The pace of foreign investment is driven by the state's access to the US market, and Chihuahua is seeking to transition from a manufacturing base into a research and design hub. The source does not give specific investment amounts, facilities, or timelines.
AI serversTaiwanese electronics makersDigiTimes AsiaCapacity Change
Research indicates that renewable energy bottlenecks in South Korea, Taiwan, and Singapore are slowing memory chipmakers' RE100 progress. The world's three largest memory manufacturers—Samsung Electronics, SK Hynix, and Micron Technology—along with Taiwan-based Nanya Technology, Winbond Electronics, and Macronix International, face significant obstacles in their transition to renewable energy.
memorySamsung Electronics, SK Hynix and 6 totalDigiTimes Asia
Related manufacturers
Samsung Electronics, SK Hynix, Micron Technology, Nanya Technology, Winbond Electronics, Macronix International
In a New Product Insider item published October 19, 2026, Mouser Electronics announced that in the third quarter of 2026 (July through September) it introduced, as an authorized global distributor, more than 5,000 new part numbers ready for shipment. Highlighted quarterly introductions include: Renesas Electronics RZ/G3SE series 64-bit general-purpose MPUs for IoT Edge applications (up to four Arm Cortex-A55 cores at up to 1.2 GHz plus a 200 MHz Cortex-M33 coprocessor); Semtech LR2021EVK2XxS1 evaluation kits based on the LR2021 LoRa Plus RF transceiver, covering 868MHz, 915MHz, 2.4GHz, S-band and L-band for satellite communications and offered in North America (915 MHz), Europe (868 MHz) and Asia (490 MHz) variants, each with two LoRa Plus RF boards and two XIAO modules based on Nordic Semiconductor's nRF54L SoC; Infineon Technologies XENSIV TLx49012 magnetic angle sensors (automotive TLE49012 and industrial TLI49012, with SPI, ABZ, PWM and UVW interfaces); and Banner Engineering S100 series multitouch displays. Mouser states its customers can expect 100% certified, genuine products fully traceable to their manufacturers. The source does not state the cause (this is a catalog-update item with no price or supply-demand event).
RZ/G3SE Quad Core MicroprocessorsLR2021 LoRa Plus RF transceiverXENSIV TLx49012 Magnetic Angle SensorsMouser Electronics, Inc., Renesas Electronics and 6 totalElectronics Sourcing
RECOM Power, the Austrian designer and manufacturer of power conversion solutions, and CELUS, a cloud-based electronics design automation company, today announced a partnership that brings a first set of RECOM power designs to the CELUS Design Platform, covering 37 RECOM CUBOs (reusable circuit modules on the platform, also known as Digital Datasheets). Twenty-nine are built around RECOM power ICs for isolated and switching DC/DC conversion and sit in the platform's Isolation and Switching DC-DC Conversion functional blocks: RVP001 (4 CUBOs), RVP003 (9 CUBOs), RVP003S (1 CUBO), RVP010 (6 CUBOs), RVP6501 (1 CUBO), RVPW011 (1 CUBO), RVPW012 (1 CUBO), RVPW014 (4 CUBOs), RVPW015 (1 CUBO) and RVPW016 (1 CUBO), each built from a RECOM reference design and named after its main power IC. The remaining eight CUBOs cover RECOM's R-78 switching regulators (6 CUBOs: R-783.3-0.5 V1/V2, R-785.0-0.5 V1/V2, R-78AA3.3-0.5 V1/V2) and RAC AC/DC converter modules (2 CUBOs: RAC02E-3.3SK/277 V1, RAC04-09SGA V1). Each CUBO combines technical specifications with application-oriented information such as interfaces, schematic context, bill-of-materials details and implementation guidance, built from RECOM data sheets, application notes and reference designs. The partnership arrives alongside the platform's new Power Nets capability, in which engineers define supply nets with voltage and direction and the Design Assistant proposes only solutions whose power specifications match those nets; designs continue in the engineer's own tools via the platform's integrations with Altium Designer, KiCad, Siemens EDA and Autodesk Fusion. The collaboration connects these RECOM designs with the more than 30,000 engineers in over 100 countries who use the CELUS Design Platform and its library of more than 560,000 components.
Volvo Cars is extending its partnership with Nvidia to develop automated driving for its future cars, aiming for the cars to handle everything from highways and city traffic to parking, and to gradually introduce eyes-off and mind-off driving. The technology will be built on Nvidia's Hyperion sensor and compute architecture, together with the Halos operating system and the Alpamayo driving software stack, while Volvo contributes its vehicle safety systems and engineering expertise. The first car to use the technology will be a next-generation Volvo model, part of what the company calls its largest-ever product push. The two companies have worked together since 2017, and Volvo's flagship SUV, the EX90, already runs on Nvidia's DRIVE Orin and DRIVE Xavier platforms.
Renesas Electronics recently released a 650-V, 20-mΩ d-mode GaN FET built on Gen 4+ technology in an 8×8 mm dual-side-cooled (DSC) PQFN package, part number TP65H020G4PLSGBD, which is sampling now to AI data center OEMs and ODMs with mass production planned for mid-2027. According to Renesas, Gen 4+ offers lower RDS(on) (and smaller size), lower gate capacitance (CGS, CGD) and output capacitance (Coss) than Gen 4, due to incremental improvements in cell design and better specific on-resistance; Gen 6 won't sample until 2027. The device is d-mode, pairing the GaN transistor with an LV silicon MOSFET. The package supports top-side, bottom-side, or dual-side cooling, currently supports 20-mΩ devices, and with future 10- to 15-mΩ devices a single cold plate may suffice. Versus TOLT, the DSC PQFN offers approximately a 57% to 60% reduction in package area in the x-y axis, is about 1 mm tall versus 2.35 mm for TOLT (2.3 mm in the table), has 9% to 10% lower thermal impedance (0.36 °C/W versus 0.4 °C/W), and cuts PCB area of a four-switch power stage by roughly 15% to 25%. In air-cooled tests on a 6-kW, 800-to-48 V IBC demo board running at 650 kHz to 1 MHz, the DSC showed a 0.14% improvement in full-load efficiency, roughly 10+ W of additional power in a 6-kW converter; liquid cooling was not used because samples had just arrived, with liquid-cooled testing as the next step. The DSC 8×8 (with 650-V GaN) is applied on the primary side, with two 3-kW blocks in series each seeing roughly 400 V of the 800-V bus. The primary applications for the DSC package technology are intermediate bus converters taking 800 V DC on the primary side down to 48 V, 12 V, and 6 V. For 800-to-6 V conversion with output currents beyond 3,000 A, Renesas is working with EPC toward a DSC option for LV GaN. Renesas showcased the device as part of its 800-V power solutions at the OCP Global Summit, held October 12–15 in San Jose, California.
650-V 20-mΩ d-mode GaN FET (Gen 4+)Renesas ElectronicsPower Electronics News