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Daeduck Electronics targets 2029 ceramic substrates for AI packaging
What happened
South Korean substrate maker Daeduck Electronics is accelerating development of ceramic core substrates (CCS) to address warpage and thermal-management challenges as AI semiconductor packages grow larger. The company is currently conducting performance and internal reliability assessments, plans to advance samples and customer evaluations in 2027 and 2028, and is targeting mass production in 2029; ceramic cores are positioned as a material alternative to glass cores for next-generation large-area packages. These remain plans/targets, with mass production not yet achieved.
Impact and signal
Medium impactImpact score: 58/100
Affected components and suppliers
ceramic core substrates (CCS)
Daeduck Electronics
ceramic core substratesCCSAI packagingmass production target 2029customer evaluation 2027-2028glass core alternative
Source and time
Source: DigiTimes Asia · 10/19/2026 · View original source
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