AI substrate bottleneck shifts from design to manufacturing

What happened

AI computing is pushing packaging density to its limits, with accelerator substrates expected to exceed 100x100mm and expand beyond 120x120mm within the next three to five years. As substrate sizes, layer counts, I/O and power requirements rise, the industry's key bottleneck is shifting from design capabilities to manufacturing capacity. The source does not name specific manufacturers or dates; the stated size expansion is an expectation rather than an achieved result.

Impact and signal

Affected components and suppliers

Source and time

Source: DigiTimes Asia · 10/19/2026 · View original source