EVG Supports Quantum Computing Development With Advanced Bonding Technology

What happened

Semiconductor equipment maker EV Group (EVG) said on Nov. 10 that it will support quantum computing development using advanced packaging technologies, including bonding, aiming to help increase qubit counts by integrating heterogeneous materials and devices into quantum chips based on various approaches, including trapped ions, superconducting circuits, photonics and spin qubits. EVG is participating as a strategic partner of Silicon Austria Labs (SAL), which leads CHAMP-ION, a European project to establish a quantum chip pilot line, and is collaborating with Xanadu, a developer of photonic quantum computing technology, on research to address manufacturing requirements for emerging quantum devices. Specific technologies include: a low-temperature metal bonding process for trapped-ion technology to integrate ion-trap chiplets and photonic chiplets fabricated on different substrate materials; oxide-free bonding for superconducting quantum devices to enable superconducting interconnects and 3D device integration; fusion bonding and oxide-free bonding for photonic devices to integrate materials such as III-V semiconductors into optical waveguides; and hybrid bonding for spin qubits to enable ultra-high-density interconnections. EVG uses its Heterogeneous Integration Competence Center (HICC) and NILPhotonics Competence Center to support customer process development and validation: HICC is equipped with wafer bonding, thin-wafer handling and lithography systems, supporting process development and pilot production for integrating heterogeneous materials and devices, while the NILPhotonics center supports optical device development using nanoimprint lithography (NIL). Bernd Dilacher, director of business development at EVG, said quantum computing presents the challenge of integrating qubits into complex chip architectures without compromising performance, as each approach has different material and manufacturing requirements. The source does not state the cause of any component supply or price impact.

Impact and signal

Affected components and suppliers

Source and time

Source: The Elec · 11/12/2026 · View original source