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Unimicron chairman sees substrate sizes reaching 14x current scale by 2030
What happened
Unimicron chairman Shan-Chieh Chien said in his opening address at TPCA Show 2026 that substrate sizes are seen reaching 14x the current scale by 2030 (a forecast stated in the title; the body does not repeat the figure). In the address, he said that solving the three major challenges facing AI accelerators in high-performance computing (HPC) will require more than semiconductor process scaling, and that advanced packaging and heterogeneous integration technologies must be introduced in parallel, significantly raising the technical requirements for the PCB and substrate industries.
Impact and signal
Medium impactImpact score: 50/100
Affected components and suppliers
substratePCB
Unimicron
substrateAI acceleratorHPCadvanced packagingheterogeneous integrationforecast
Source and time
Source: DigiTimes Asia · 10/20/2026 · View original source
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