DIGITIMES Insight: Entering glass substrate era, core layers are no longer an exclusive process for substrate makers

What happened

DIGITIMES observes that as AI accelerators continue to grow in size, substrate dimensions are gradually moving beyond 100x100mm, and warpage issues in organic substrates have become increasingly pronounced, prompting industry players to invest in the development of different core-layer materials. Glass, which offers excellent flatness and an adjustable coefficient of thermal expansion (CTE) that can be brought closer to that of silicon, can help reduce warpage, and has emerged as a closely watched core-layer solution and a key focus of future technology development. The source does not specify manufacturers, timelines, or mass-production status.

Impact and signal

Affected components and suppliers

Source and time

Source: DigiTimes Asia · 11/11/2026 · View original source