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Samsung targets early 2027 for first 3D Cube-H design kit
What happened
According to ZDNet Korea on November 10, citing an industry source familiar with the plans, Samsung Electronics aims to complete its first 3D Cube-H design kit—a hybrid copper bonding technology for vertically stacked logic chips—in early 2027, with prospective customer evaluations to follow. The event remains in a planned status; the design kit has not been completed and customer evaluations have not yet begun.
Impact and signal
Medium impactImpact score: 50/100
Affected components and suppliers
3D Cube-H design kit
3D Cube-Hdesign kithybrid copper bondingvertically stacked logic chipsSamsung
Source and time
Source: DigiTimes Asia · 11/10/2026 · View original source
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