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Samsung Chairman Lee Jae-yong Visits Advanced Packaging Research Center in Japan

What happened

Samsung Electronics Chairman Lee Jae-yong visited the Advanced Package Lab (APL) in Yokohama, Japan, on Nov. 1, marking his first on-site inspection since the facility opened on Sept. 8. APL plans to invest 40 billion yen over five years starting in 2024, focusing on wafer bonding, glass substrates, and AI semiconductor packaging architectures, aiming to become a global R&D hub connecting Japanese ecosystem with Samsung's technology.

Impact and signal

Medium impactImpact score: 60/100

Affected components and suppliers

advanced packagingwafer bondingglass substratesAI semiconductors

Samsung Electronics

SamsungJapanAdvanced PackagingR&DInvestmentLee Jae-yong

Source and time

Source: The Elec · 11/2/2026 · View original source

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Samsung Chairman Lee Jae-yong Visits Advanced Packaging Research Center in Japan

What happened

Impact and signal

Affected components and suppliers

Source and time

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