Samsung reportedly plans 2nm fab to boost HBM base-die output

What happened

According to the Seoul Economic Daily on November 4, Samsung Electronics is preparing to build a 2nm- and 4nm-class foundry fab at its Giheung campus in Yongin, South Korea, to expand production of logic base dies used in high-bandwidth memory (HBM). The fab is estimated to cost KRW25 trillion (approx. US$18.6 billion); if an existing production line is converted into an advanced packaging facility, the broader project could potentially reach KRW30 trillion. The fab is in the preparation/planning stage; the report gives no completion or production timeline and does not state any capacity or demand-related cause behind the plan.

Impact and signal

Affected components and suppliers

Source and time

Source: DigiTimes Asia · 11/4/2026 · View original source