GF to run 7nm process next year
What happened
GlobalFoundries says it intends to demo a 7nm FDSOI process called FDX Fusion in early 2027: demonstrator silicon is scheduled for early 2027, process design kits (PDK) in mid-2027, and volume manufacturing is planned for 2028 at its Dresden facility, which was backed by the €1.1 billion SPRINT expansion. The process claims to deliver more than double the transistor density of first-generation 22FDX, with logic density reaching 14M–18M gates/mm²; it is said to be designed for Physical AI and edge applications, does not require EUV lithography and uses DUV scanners, and integrates high-frequency RF performance up to 0.5 THz, analogue/mixed-signal capabilities, in-memory computing, and eMRAM. Industrial collaborators on the process are said to include BMW, Bosch, Infineon, NXP, Siemens, and Tesla. Last quarter GlobalFoundries announced Q3 revenue of $1.9 billion for a loss of $270 million.
Impact and signal
Affected components and suppliers
Source and time
Source: Electronics Weekly · 11/8/2026 · View original source
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