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GlobalFoundries VP details FDX Fusion technology, sporting 7nm-class performance without the need for EUV tools — company targets 2030 for high-volume manufacturing, with planar transistors in tow
What happened
GlobalFoundries revealed new details about its FDX Fusion technology, which promises 7nm-class performance and 8nm-class logic density using planar FD-SOI transistors without EUV lithography tools. The company targets 2030 for high-volume manufacturing of the node and shared what is next for the FDX Fusion node and the FDX program in general. This is a technology roadmap disclosure: high-volume manufacturing remains a plan/target for 2030 and has not been achieved; the source does not state the cause.
Impact and signal
Medium impactImpact score: 55/100
Affected components and suppliers
FDX Fusion
GlobalFoundries
FDX FusionFD-SOIplanar transistors7nm-class performance8nm-class logic densityno EUV lithography
Source and time
Source: Tom's Hardware · 11/6/2026 · View original source
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