DEEPX Says DX-M1 Chip Keeps Butter From Melting

What happened

DEEPX said on Nov. 6 that it had introduced its low-heat AI chip, DX-M1, in the United States. CEO Kim Nok-won said in an interview with CNBC on Nov. 5 local time that the company's chips showed temperature differences of 25 to more than 40 degrees Celsius compared with competing products under identical AI processing conditions; 'when butter was placed on each chip under identical AI processing conditions, only the butter on the DEEPX chip did not melt.' DX-M1 is a low-power neural processing unit (NPU) developed in-house by DEEPX that supports high-performance AI inference while consuming less than 5 watts of power, with relatively little heat during prolonged operation achieved by reducing its die size. The chip has been in mass production using Samsung Electronics' 5-nanometer-class semiconductor process since August 2025; as of October 2026, DEEPX had secured 88 purchase orders (POs) across 10 countries, totaling approximately $13.3 million. Kim added that DX-M1 will be installed in the first commercial robot scheduled for release this year by Hyundai Motor Group's Robotics Lab; the products DEEPX is reportedly collaborating on with Hyundai Motor include the DAL-e autonomous mobile robot (AMR) delivery platform and the MobED mobility platform. DEEPX is also developing DX-M2, a next-generation AI semiconductor based on Samsung Electronics' 2-nanometer process, designed to run generative AI workloads including large language models (LLMs) at low power consumption, with mass production targeted for the second half of 2027. DEEPX forecasts revenue of $40 million this year, more than double its previous target of $17 million announced last year; the company recorded annual revenue of 3.3 billion won and an operating loss of 20.1 billion won in 2025.

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Source: The Elec · 11/8/2026 · View original source