DEEPX, AMD Discuss AI Chip Technology Cooperation

What happened

DEEPX, a fabless semiconductor company specializing in edge artificial intelligence (AI) chips, said on Nov. 3 that it discussed potential technology cooperation with AMD. Keith Strier, AMD's senior vice president of global AI markets, and Jang Jung-hee, head of AMD Korea, visited DEEPX's headquarters in Pangyo that day and met with DEEPX CEO Kim Nok-won to discuss potential collaboration in physical AI and heterogeneous computing. DEEPX proposed two areas of cooperation: the first involves integrating its low-power neural processing unit (NPU) with AMD's Kria system-on-module (SOM) platform, enabling a single module to handle real-time robotic control and AI inference; the second involves linking AMD's ROCm software platform for GPUs with DEEPX's software development kit (SDK), with the goal of creating a computing environment that distributes workloads among CPUs, GPUs and NPUs according to their respective strengths. Discussions began at the AMD-Korean AI Semiconductor Companies Roundtable hosted by the Ministry of Science and ICT on Oct. 7, where AMD CEO Lisa Su met with Kim, followed by a visit to DEEPX by AMD Korea representatives on Oct. 21. The cooperation remains at the discussion and proposal stage; no agreement has been announced.

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Source and time

Source: The Elec · 11/4/2026 · View original source