DEEPX Begins Mask Production for Samsung 2nm AI Chip, Targets Q4 2027 Mass Production

What happened

On Nov. 10, fabless semiconductor company DEEPX announced it has completed the design of its next-generation AI chip, DX-M2, and completed the mask tape-out (MTO) for prototype production in early November, meaning the finalized chip design data has been transferred to the foundry and lithography distortion corrections completed; photomask production will follow. The chip will be manufactured using Samsung Electronics' second-generation 2nm foundry process, known as SF2P. DEEPX plans to obtain first silicon chips in March 2027, provide evaluation samples to customers in the second quarter, schedule initial mass-production shipments for the fourth quarter of 2027, and plans full-scale production and global supply expansion from 2028. The DX-M2 is designed to run generative AI workloads including LLMs and VLMs at around 5 watts, targets robotics and industrial systems, and received a CES 2027 Innovation Award in the AI category. Background: DEEPX began mass production of its DX-M1 chip, based on Samsung's 5nm process, in August 2025; as of October 2026 the company had secured 88 purchase orders worth about $13.3 million across 10 countries; the company forecasts revenue of $40 million this year, more than double its previous 2026 revenue target of $17 million announced last year; and it recorded annual revenue of 3.3 billion won and an operating loss of 20.1 billion won in 2025. The mass-production shipments and supply expansion remain planned and have not yet occurred.

Impact and signal

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Source and time

Source: The Elec · 11/12/2026 · View original source