NuAxiSemiconductor trade intelligence
Hanmi targets 2027 Wide TC Bonder launch, expands 2.5D AI chip packaging lineup
What happened
South Korean semiconductor equipment maker Hanmi Semiconductor showcased its high-bandwidth memory (HBM) and AI chip packaging equipment at SEDEX 2026, including the TC Bonder 4 for HBM4 production and the Wide TC Bonder, which is scheduled for launch in 2027 (planned, not yet launched per the source). The company also introduced five 2.5D packaging systems designed to accommodate increasingly large AI chip packages.
Impact and signal
Medium impactImpact score: 55/100
Affected components and suppliers
TC Bonder 4Wide TC Bonder2.5D packaging systems
Hanmi Semiconductor
Source and time
Source: DigiTimes Asia · 10/18/2026 · View original source
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