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Hanmi's 2.5D bonders pass Taiwan foundry qualification as packaging outsourcing expands
What happened
Hanmi Semiconductor's 2.5D packaging bonders have passed mass-production qualification at a Taiwan foundry, allowing the company to supply equipment as the advanced packaging supply chain expands beyond foundry-owned lines.
Impact and signal
High impactImpact score: 85/100
Affected components and suppliers
2.5D BondersPackaging Equipment
Hanmi Semiconductor
capacityorderpackaging
Source and time
Source: DigiTimes Asia · 9/5/2026 · View original source
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