NuAxiSemiconductor trade intelligence

BOE eyes closer ties with Samsung, LG as it pushes into chip packaging

What happened

BOE seeks closer ties with Samsung and LG to expand into semiconductor glass substrates and advanced packaging. This move aims to leverage partners' expertise to push BOE into the semiconductor packaging supply chain. Watch: The partnership signals potential capacity expansion in glass substrates, requiring monitoring of future execution.

Impact and signal

Medium impactImpact score: 60/100

Affected components and suppliers

Glass SubstratesAdvanced Packaging

BOE Technology Samsung ElectronicsLG Electronics

partnershipglass-substrateadvanced-packaging

Source and time

Source: DigiTimes Asia · 9/30/2026 · View original source

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BOE eyes closer ties with Samsung, LG as it pushes into chip packaging

What happened

Impact and signal

Affected components and suppliers

Source and time

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