NuAxiSemiconductor trade intelligence

RT NEWS: 👀 With #TSMC CoWoS still constrained, #SKhynix is said to be testing #Intel's #EMIB 2.5D packaging using its own #HBM. Is Team Blue's adva...

What happened

SK hynix is testing Intel's EMIB 2.5D packaging technology for its HBM to bypass TSMC's CoWoS capacity constraints. This partnership aims to secure supply and validate Intel's advanced packaging capabilities in the high-bandwidth memory market.

Impact and signal

Medium impactImpact score: 55/100

Affected components and suppliers

HBM

SK hynix Intel

packagingpartnershipsupply-chain

Source and time

Source: TrendForce Official (Market Data) · 5/11/2026 · View original source

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RT NEWS: 👀 With #TSMC CoWoS still constrained, #SKhynix is said to be testing #Intel's #EMIB 2.5D packaging using its own #HBM. Is Team Blue's adva...

What happened

Impact and signal

Affected components and suppliers

Source and time

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