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Intel hires former SK hynix chief Seok-Hee Lee to lead Intel Foundry advanced packaging — company establishing section as 'focused business with dedicated leadership'

What happened

Intel splits advanced packaging into a standalone business led by former SK hynix CEO Seok-Hee Lee, with EMIB-T technology rolling out in production fabs this year to compete with TSMC's oversubscribed CoWoS capacity.

Impact and signal

Medium impactImpact score: 60/100

Affected components and suppliers

EMIBAdvanced PackagingHBM

Intel SK hynix TSMC Google Amazon

EMIB-T

capacity_expansionadvanced_packagingemibco-wos_competition

Source and time

Source: Tom's Hardware · 6/19/2026 · View original source

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Intel hires former SK hynix chief Seok-Hee Lee to lead Intel Foundry advanced packaging — company establishing section as 'focused business with dedicated leadership'

What happened

Impact and signal

Affected components and suppliers

Source and time

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