NuAxiSemiconductor trade intelligence

RT NEWS: 🚀 #GlassSubstrates are key for #CPO, but TGV interconnects remain a major hurdle. New ultrafast laser tech developed by South Korean-led r...

What happened

South Korean-led researchers have developed ultrafast laser technology to address the TGV interconnect bottleneck in glass substrates, potentially facilitating CPO applications.

Impact and signal

Low impactImpact score: 10/100

Affected components and suppliers

Glass SubstratesTGV Interconnects

R&DGlass SubstrateCPO

Source and time

Source: TrendForce Official (Market Data) · 4/29/2026 · View original source

Open the NuAxi live feed →

Real-time pricing, supply signals and AI analysis for semiconductor traders

[News] Intel-Backed Firm Breaks Ground on India’s 1st 3D Packaging Plant, Targeting ~70K Glass Substrates AnnuallyTrendForce · 4/20/2026
[News] SKC Reportedly Channels Over Half of ₩1T Capital Increase Into Absolics to Fast-Track Glass SubstratesTrendForce · 3/2/2026
BOE eyes closer ties with Samsung, LG as it pushes into chip packagingDigiTimes Asia · 9/30/2026
🔥 #China reportedly has more than 10 companies pursuing #glasssubstrates, with some said to be narrowing the gap with South Korean rivals, while #B...TrendForce Official (Market Data) · 6/10/2026
RT NEWS: 🚀 #Intel-backed 3D Glass Solutions has broken ground on #India's first 3D chip packaging facility, with CEO Lip-Bu Tan attending the cerem...TrendForce Official (Market Data) · 4/21/2026
🚀 As #NVIDIA begins shipping #CPO switches, co-packaged optics enters mass production. With optical engine yields, silicon photonics capacity, and ...TrendForce Official (Market Data) · 7/27/2026

RT NEWS: 🚀 #GlassSubstrates are key for #CPO, but TGV interconnects remain a major hurdle. New ultrafast laser tech developed by South Korean-led r...

What happened

Impact and signal

Affected components and suppliers

Source and time

Related briefings