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EVG highlights heterogeneous integration technologies at ECTC
What happened
EV Group presented papers on its latest wafer-to-wafer and die-to-wafer bonding, lithography, and IR laser release technologies at the ECTC 2024 conference. The developments are focused on enabling heterogeneous integration for next-generation semiconductor packages. Neutral: This is a long-term R&D milestone for packaging equipment with no immediate impact on component supply, pricing, or trader decisions.
Impact and signal
Low impactImpact score: 8/100
Affected components and suppliers
Advanced Packaging Equipment
EV Group
heterogeneous-integrationpackagingequipment
Source and time
Source: Semiconductor Today · 5/28/2024 · View original source
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