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[News] Hybrid Bonding Leader BESI Reportedly Draws Takeover Interest; Lam, Applied Materials Rumored

What happened

BESI, a leader in hybrid bonding equipment critical for HBM, is reportedly evaluating takeover approaches, with Lam Research and Applied Materials named as potential suitors. Concurrently, JEDEC's potential relaxation of HBM thickness standards could slow the adoption of hybrid bonding in favor of cheaper thermocompression bonding. Watch: M&A could consolidate supply, while a standards shift poses a direct risk to BESI's core growth strategy.

Impact and signal

Medium impactImpact score: 45/100

Affected components and suppliers

HBMAdvanced Packaging Equipment
BE Semiconductor (BESI)Lam ResearchApplied MaterialsLG ElectronicsSEMESHanmi Semiconductor
mergers-acquisitionstechnology-adoptionsupply-chain-consolidation

Source and time

Source: TrendForce · 3/12/2026 · View original source

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