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NuAxi Stream - Real-Time Semiconductor Intelligence

NuAxi Stream - Real-Time Semiconductor Intelligence

Mon, Oct 12

1 items

07:23Impact score 40
AI功率密度推动先进封装采用更薄TIMs、更低热阻与更严翘曲控制的新材料要求
据EE Times Asia文章，AI驱动的功率密度正推动先进封装向更薄的热界面材料(TIMs)、更低热阻、更严格的翘曲控制以及新的材料要求方向发展。原文未提及具体公司、产品型号、价格变动或时间安排。
TIMs

Wed, Sep 2

1 items

03:49Impact score 10
台积电将微通道冷却纳入路线图
台积电将微通道冷却纳入研发路线图，以解决AI芯片功耗激增的问题（5年内6倍）。随着封装功耗从600W增加到4100W，行业正从风冷转向液冷。
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该技术代表了先进封装的长期方向，但制造挑战意味着短期内不会出现供应中断。
HBM Advanced PackagingTSMCTechnical

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Chip Teardown Lab1 opened

Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.

Component price indexNPI, vs. prior period

	$0.68	−5.9%
	$0.75	+0.2%
	$386.74	−21.3%
	$88.40	−0.2%
2026-W13	$14.89	−11.2%
	$478.20	+8.2%
	$0.68	−61.7%Unusual
	$0.01	+54.0%Unusual
	$0.12	−82.8%Unusual
2026-W13	$0.44	−12.5%
	$288.43	n/a

Period 2026-W18