[News] Korean and Japanese Researchers Unveil New AI Memory Architectures to Address HBM Thermal Limits
Korean and Japanese researchers presented two novel memory architectures, V-Die and MOSAIC, at the 2026 IEEE symposium to address HBM thermal limits by vertically arranging DRAM dies. V-Die utilizes edge I/O and liquid cooling to achieve four times the interconnects and 37% lower latency, while MOSAIC uses inductive coupling to improve manufacturability and thermal conductivity. Neutral: These technologies remain in the prototype stage and do not impact current spot prices.
- Related manufacturers
- SK hynix, Samsung Electronics, Micron, UNIST, University of Tokyo
- Impact score
- 10 / 100, low impact