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[News] Korean and Japanese Researchers Unveil New AI Memory Architectures to Address HBM Thermal Limits
What happened
Korean and Japanese researchers presented two novel memory architectures, V-Die and MOSAIC, at the 2026 IEEE symposium to address HBM thermal limits by vertically arranging DRAM dies. V-Die utilizes edge I/O and liquid cooling to achieve four times the interconnects and 37% lower latency, while MOSAIC uses inductive coupling to improve manufacturability and thermal conductivity. Neutral: These technologies remain in the prototype stage and do not impact current spot prices.
Impact and signal
Low impactImpact score: 10/100
Affected components and suppliers
Source and time
Source: TrendForce · 7/14/2026 · View original source
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