NuAxi Stream - Real-Time Semiconductor Intelligence

Mon, Oct 19

03:47Impact score 60
[News] MediaTek’s Google TPU v9 Shipments May Slip to 1Q28; ASIC Race Heats Up as Taiwan Firms Eye Opportunities
According to Commercial Times, citing institutional investors, Google's TPU v9 project, involving MediaTek, could see its initial tape-out delayed until January 2027 following design revisions, with shipments potentially pushed back to the first quarter of 2028; the November 2026 sampling target remains unchanged, and the production-version tape-out is expected in the second quarter. The report notes that revisions to Google's TPU v9 Core A design, codenamed Humifish... wait, Humufish, have delayed development by approximately three weeks, affecting the Core B and I/O designs handled by MediaTek. According to TrendForce, the chip is expected to adopt Intel's EMIB-T advanced packaging, with substrate yields remaining a key challenge to production scalability and cost competitiveness. Bloomberg, citing sources, reports that ByteDance is nearing an agreement to purchase MediaTek's data center chips, potentially making it MediaTek's second major ASIC customer after Alphabet's Google. Among Taiwanese ASIC design firms: GUC, supported by cloud customers' CPU and ASIC programs, reported record September revenue of NT$7.145 billion, up 97.8% year over year; Alchip posted September revenue of NT$9.979 billion, surging 496% year over year as shipments of 3nm AI accelerators increased. Faraday has obtained Samsung's 2nm process design kit (PDK) to pursue related design opportunities; per Commercial Times, Samsung's 4nm capacity is reportedly fully utilized, prompting some AI ASIC customers to evaluate its 2nm node. Faraday has also completed its design environment setup for Intel's 18A-P and begun offering design services, with plans to pursue more projects in 2027. Commercial Times, citing institutional investors, projects global AI ASIC accelerator shipments to reach 14.1 million units in 2027, up approximately 69% year over year.
Google TPU v9Core A (codenamed Humufish)Core BMediaTek, Google and 11 totalTrendForce

Sun, Oct 18

21:00Impact score 0
CEO Interview with Dr. Raj Talluri of Kulicke & Soffa
Kulicke & Soffa reported fiscal Q3 2026 net revenue of $330.4 million, up 123% year-over-year, with gross margin of 47.8% and non-GAAP EPS of $1.20, beating expectations. The company guided to roughly $375 million for Q4 fiscal 2026 ending October 3, 2026, citing strengthening demand across semiconductor, memory, automotive, and industrial markets.
SemiWiki
07:22Impact score 55
“Korea, Taiwan Couldn’t Have Succeeded Without US”: SEMI Americas Chief
SEMI Americas President Joe Stockunas stated at SEMICON West 2026 on Oct. 15 that the industry would like to see investment tax credits for fab construction extended to supplier infrastructure and is working to make it happen. He noted announced investments exceed $800 billion and there are $330 billion in announced investments in Phoenix.
supplier infrastructureThe ElecPolicy/Regulation
07:21Impact score 60
Intel to Launch Razor Lake AX Robotics SoC in 2028
At the "Semiconductors Powering Humanoids" conference held at COEX in Samseong-dong, Seoul, on Oct. 16, Intel vice president Cho Min-sung said the company plans to launch Razor Lake AX, a new SoC designed for robotics applications, in 2028, targeting performance of around 700 TOPS. Intel's current Panther Lake-based robotics development tools theoretically deliver 180 TOPS, and the next-generation Nova Lake is planned for introduction early next year. The article notes that Nvidia's Jetson AGX Orin, an SoC designed for robotics, delivers approximately 275 TOPS. Cho said domestic customers are planning to begin mass production of autonomous mobile robots (AMRs) next year, while most are targeting 2028 for humanoids, which also explains the planned 2028 launch of Razor Lake AX. Intel aims to support deployment of complete robotic systems through its Core Ultra Series 3 robotics computing platform, which integrates a CPU, NPU and GPU and can be used across industrial robotic arms, AMRs and humanoids; Intel also provides the Robinson Bay development platform and software tools including OpenVINO, Physical AI Studio and Robotics AI Suite. These launches remain plans and have not been implemented.
robotics SoCIntelThe Elec
07:21Impact score 30
Intel Unveils AI Inference Software Optimized for Xeon CPUs
On Oct. 16, Intel unveiled Intel Inference Microservice, software designed to maximize AI inference performance on its Xeon server CPUs. The containerized software enables rapid optimization of large language models (LLMs) for CPUs and includes libraries with the code, engines and configurations needed to run open-source LLMs. When launched, it detects the Intel processor and applies prevalidated and tuned AI inference settings, reducing reliance on AI inference optimization specialists. Major AI frameworks including the OpenAI SDK, LangChain, LlamaIndex, LiteLLM and Haystack support the OpenAI API specification, and the software uses the open-source vLLM as its default inference engine. The source notes that optimizing existing LLMs for hardware previously took a week, with settings for computational precision, workload distribution across CPU cores, memory allocation across NUMA nodes and hardware instruction set selection varying by AI model and processor combination. Intel also plans to expand Inference Microservice support to its entire GPU lineup, including the D-series GPUs designed for AI inference (this is a plan).
Xeon server CPUsD-series GPUsIntelThe Elec
02:37Impact score 25
ASUS Makes Its First Intel Arc Card, a 32 GB Arc Pro B70 Under the UGen AI Brand
ASUS has listed the UGen Arc Pro B70 32 GB on its website, making it the company's first Intel Arc graphics card; its last Intel discrete card was the passively cooled Iris Xe DG1-4G from 2021, and ASUS sat out both the Alchemist and Battlemage consumer generations. ASUS files it under its UGen AI accelerator lineup rather than ProArt, in the same family as the UGen300 USB AI accelerator shown at CES 2026. ASUS has not announced pricing or a release date yet. Intel launched the Arc Pro B70 at $949 in March, though US retail listings now seem to sit closer to $1,300. The ASUS card uses the full "Big Battlemage" BMG-G31 die with 32 Xe2 cores, 256 XMX engines, and 32 GB of GDDR6 ECC memory on a 256-bit bus for 608 GB/s of bandwidth, rated at a 2,800 MHz boost clock, up to 367 INT8 TOPS, and a 290 W board power (the top of Intel's 160 to 290 W range for the B70, with the reference default at 230 W). Cooling comes from a dual-slot blower, and ASUS says four cards can be paired for 128 GB of combined VRAM, enough for models with up to 120 billion parameters according to the company. ASUS joins ASRock, Sparkle, and Maxsun, which already have their own B70 models, so pricing will likely decide how well the UGen version does.
Intel Arc Pro B70 GPUBMG-G31 dieGDDR6 ECC memoryASUS, Intel and 5 totalTechPowerUp
00:53Impact score 60
Intel "Razor Lake-AX" to Pack 700 TOPS of AI Compute
Intel announced that its upcoming Razor Lake-AX platform will feature 700 TOPS of AI compute on die, outperforming the current Panther Lake mobile chips (180 TOPS) by 3.88 times.
AI computeIntelTechPowerUp

Sat, Oct 17

22:38Impact score 60
Nvidia reportedly insists the RTX 5090 isn't dead despite severe shortages and removed listings at multiple retailers
As reported by Tom's Hardware on 17 October 2026, after rumors that RTX 5090 production was stopping, Nvidia senior VP Jeff Fisher reportedly said in a purported post-event interview that the card has not been discontinued and will continue to ship. He reportedly stated: "The supply chain (capacity) is indeed somewhat constrained, but NVIDIA is doing everything it can to get the product on the market... production has not been discontinued, and NVIDIA will continue to ship," while noting other variants of the RTX 5090 (chip) exist. Earlier rumors held that, after Nvidia reportedly put the RTX 50 Super series on hold, production of the already-rare RTX 5090 was stopping, likely to use precious silicon manufacturing capacity for more AI accelerators. Retail spot-checks: RTX 5090s on Amazon sell for about $8,500 from third-party sellers; Newegg lists 5090s for about $7,300, likely from Chinese sellers judging by shipping time, with U.S. tariffs likely adding to the price; Best Buy has zero cards on offer; and as of this writing the card remains absent from Nvidia's own marketplace and Micro Center. Tom's Hardware received no reply from Nvidia for comment; the claims are reported second-hand, and production status is not officially confirmed.
RTX 5090NvidiaTom's HardwareCapacity Change
00:30Impact score 0
China startup demoes prototype EUV light source
According to Tom's Hardware, published 16 October 2026, Chinese startup Langdao Silex (established in 2024 by Tsinghua University's Gas Discharge Plasma Laboratory alumni) demonstrated a prototype EUV light source with over 15W of output power, 90% domestic components, and decent uptime at the 26th China International Industry Fair in Shanghai, without lighting it up. The FlintNano LPP-OXXO system uses laser-produced plasma (LPP) technology with a 1,000W driving laser operating at 1kHz–20kHz, conversion efficiency exceeding 2%, brightness of 100 W/(mm²·sr), continuous operation of over 100 hours, plasma stability of 3% RMS and EUV output power stability of 5%; however, its output remains insufficient for high-volume chip production, and the company has not disclosed whether the 15W is measured at the plasma or at intermediate focus. Per TrendForce, citing various sources, the company will need another three to five years to commercialize its technology. Langdao is also developing the higher-power FlintMicro-LPP EUV source, which has completed proof-of-principle validation, but its output power, conversion efficiency and operating lifetime are undisclosed. A light source alone does not make an EUV scanner; a complete EUV lithography scanner would require further advances in collection/illumination optics, multilayer mirrors, wafer and reticle stages, and system integration.
EUV light sourceLangdao SilexTom's Hardware

Fri, Oct 16

21:00Impact score 0
Terafab’s Single Roof: Why Packaging, Not Lithography, Decides High Volume
Terafab’s project has secured $16.8 billion for phase‑one funding (up to $119 billion total across four phases); its research fab in Austin is iterating on process recipes, transistor designs and packaging variants at a few thousand wafers per month, while the volume fab under construction in Grimes County is targeting 100,000 wafer starts per month with first silicon expected in 2029, using Intel’s 14A process as named by Elon Musk. The site and phase‑one funding are approved and the research fab is under construction, but no first‑wafer date or ownership terms have been made public and neither Tesla nor Intel is contractually bound. The article argues that advanced packaging, not lithography, will determine whether the single‑roof concept pays off.
SemiWiki
20:14Impact score 25
Intel "Nova Lake-HX" and "Nova Lake-H" Die Shots Appear
Bare-die shots revealed via the Moore's Law Is Dead YouTube channel have exposed details of Intel's upcoming "Nova Lake" lineup for mobile devices. The "Nova Lake-HX" features an 8+16+4 core configuration with 8 P-Cores, 16 E-Cores, and 4 LPE-Cores, with total silicon measuring 12x30 mm amounting to 360 mm², divided across six dies on various nodes: the graphics tile is built on the Intel 3-E node, embedding 4 Xe GPU cores and covering roughly 26 mm²; a 21 mm² dummy die provides structural integrity of the package; a large 72 mm² die on the Intel 18A-P node hosts 4 LPE-Cores and serves as a central hub; another 18A-P die of 58 mm² functions as a peripheral control tile; the main compute tile is made at an external foundry on the TSMC N2P node and hosts the 8P+16E CPU core configuration, occupying the largest area of 104 mm²; a passive tile of 85 mm² sits beside it for the structural integrity of the package and the intended operation of the "Nova Lake-HX" chip. The less powerful "Nova Lake-H" variant features a 4+8+4 configuration with 4 P-Cores, 8 E-Cores, and 4 LPE-Cores; its package is significantly smaller at 12x23 mm for a total die area of 276 mm². The die configuration remains the same except for the main compute tile, which hosts a 4P+8E-core configuration on the TSMC N2P node occupying 55 mm²; its adjacent passive die is smaller at only 45 mm², while the peripheral control die, central hub die, and graphics tile are all made on Intel nodes and remain the same as in the "HX" variant.
mobile processorsCPU coresGPU coresIntel, TSMCTechPowerUp
18:55Impact score 96
Corsair's Vengeance RGB DDR5 32GB memory receives a $108 price cut
According to a deal post published by Tom's Hardware on 16 October 2026, the Corsair Vengeance RGB DDR5 32GB (2 x 16GB) memory kit (DDR5-5600, CAS latency CL40, with RGB lighting and Intel XMP profiles) is now priced at $409.99, down from $517.99 — a $108 cut, or 21% off — available direct from Corsair. The author verified via Tom's Hardware's own price tracking and other online resources that this is the cheapest available DDR5 5600 memory kit currently purchasable. The article notes as background that RAM and storage prices had previously risen sharply amid the ongoing AI boom, and states the author's view that prices may rise further and that production may not normalize for up to a decade; these are contextual assertions, not confirmed facts. The specific cause of this price cut is not stated by the source (the source does not state the cause).
Corsair Vengeance RGB DDR5 32GB (2 x 16GB) 5600 memory kitCorsairTom's HardwarePrice Movement
14:49Impact score 0
Intel to Showcase Physical AI at Web Summit 2026
Intel said on Oct. 15 local time that it will showcase physical AI technologies designed for real-world industrial applications at Web Summit 2026. The demonstrations will feature various types of robots deployed across industries including manufacturing, smart cities, retail and healthcare, and Intel will also introduce its semiconductor chips and AI inference platforms used in these products. Intel said its Core Ultra Series 3 processors, software and partner ecosystem provide practical support for robotics manufacturers and developers, enabling AI systems to move beyond prototypes and operate in real-world environments with high reliability, fast response times and cost efficiency. Web Summit is a global IT and technology exhibition scheduled for Nov. 9-12 in Lisbon, Portugal. the source does not state the cause.
Core Ultra Series 3 processorsAI inference platformsIntel, MovensysThe Elec
12:23Impact score 10
Analysis: Intel CEO Lip-Bu Tan's power of humility — how one phone call helped reshape the chip giant's comeback
This is an analysis article focusing on Intel CEO Lip-Bu Tan's power of humility and how one phone call helped reshape the chip giant's comeback. As background, the article notes that as the semiconductor industry enters the artificial intelligence (AI) era, Intel, once the dominant force in the PC market, has increasingly been viewed as a company that fell behind in the AI race. The source does not state the cause, and the article contains no specific price, capacity or policy event; it is background analysis content only.
IntelDigiTimes Asia
08:23Impact score 75
Intel silent on Israeli Fab 28 output after deadly blast, leaving CPU supply outlook unclear
An explosion occurred at Intel's chip plant in Kiryat Gat, southern Israel, on October 14, killing two workers and leaving a third in serious condition. The site makes chips on Intel's capacity-constrained Intel 7 process. As of the report, Intel has not yet said whether production at the plant has been affected, leaving the CPU supply outlook unclear. The source does not state the cause of the explosion.
CPUIntelDigiTimes AsiaDisaster/Disruption
07:18Impact score 60
[News] After TSMC’s 3Q26 Earnings: Key Brokerage Takeaways as 2028 Capex Forecasts Reach US$105B
Following TSMC's 3Q26 earnings, foreign brokerages published takeaways: TSMC raised its 2026 revenue growth outlook to 44% YoY and forecast another record quarter in 4Q26, while maintaining 2026 capex guidance at US$60–64 billion but signaling significantly higher spending over the next three years; the article notes that amid reports of rising semiconductor equipment prices, TSMC acknowledged that "tool inflation is real," setting the stage for further capex increases. Brokerages accordingly raised capex forecasts: UBS is the most bullish, expecting spending to surge roughly 45% YoY to US$90 billion in 2027 before climbing to US$105 billion in 2028; Morgan Stanley, citing initial checks with equipment suppliers, suggested EUV tool bookings could double in 2027 followed by another 25–30% increase in 2028, and raised its capex estimates to US$83 billion and US$92 billion respectively; Goldman Sachs and BofA Securities both see 2027 spending reaching US$85 billion. These figures are plans/forecasts, not realized spending. Capacity: TSMC plans to accelerate 2nm production and expand 3nm capacity (four fabs planned for the latter); 2nm's revenue share jumped to 8% in 3Q26 from 3% the previous quarter, with management expecting capacity to "more than double in 2027." Margins face headwinds: 4Q gross margin guidance of 65–67% suggests limited upside from 3Q's 66.4% (brokerage assessments attribute this to the 2nm ramp weighing on profitability); Citi, UBS and Goldman Sachs all project a 66.6% gross margin for 2026, rising to 66.7–68.9% in 2027 and 67.1–68.9% in 2028. Pricing: Daiwa forecasts TSMC's blended ASP on 8-inch-equivalent wafers rising from US$3,513 in 2026 to US$4,034 in 2027 and US$4,231 in 2028; UBS's model is more bullish at US$3,691/US$4,417/US$5,177 for 2026/2027/2028. Advanced packaging: Aletheia expects cutting-edge wafer revenue to double and advanced packaging revenue to quadruple between 2026 and 2028; Goldman Sachs projects CoWoS capacity reaching 1.275 million wafers in 2026 (about 106,000 per month), surging 114% YoY to 2.73 million in 2027 (227,500 monthly), then climbing another 27% to 3.48 million wafers in 2028 (nearly 290,000 per month).
2nm3nmCoWoSTSMCTrendForceCapacity Change
06:28Impact score 15
[News] Apple Reportedly Skips High-End M6 Chips for M7 Lineup; Partners With Meta to Run Muse AI on Mac Studio
According to MacRumors, citing Bloomberg's Mark Gurman on his podcast, Apple is reportedly shifting its focus to the M7 chip lineup, skipping higher-end M6 variants as it prioritizes technologies designed for AI workloads; Apple has introduced the base M6 chip in the Mac mini, with M6-powered iMac and entry-level MacBook Pro models also planned, but the company reportedly intends to skip the M6 Pro, M6 Max, and M6 Ultra, moving directly from their M5 predecessors to the M7 lineup. Gurman noted that high-end touchscreen MacBook Pro models featuring M7 Pro and M7 Max chips are expected by the end of 2027, while an entry-level MacBook Pro powered by the standard M7 is also slated for 2027; the M7 Ultra is reportedly planned for the first half of 2028, making a Mac Studio refresh in 2027 unlikely. Per MacRumors, the upcoming OLED MacBook Pro models are expected to retain the M5 Pro and M5 Max chips used in current models, with no processor upgrade planned until 2027. Separately, according to CNBC, Apple and Meta have announced plans to enable developers to run Meta's Muse Spark Open model locally on Apple's high-end Mac Studio desktops; Meta describes Muse Spark Open as its most capable U.S. open-weight model, featuring 816 billion total parameters, 42 billion active parameters, and a 1 million-token context window, built on a mixture-of-experts architecture and designed to run locally on M5 Ultra-powered Mac Studios using Apple's MLX framework; each M5 Ultra supports up to 512GB of unified memory and 1.2TB/s of memory bandwidth, allowing two connected Mac Studios to accommodate the entire model. According to CNBC, a Mac Studio equipped with the required M5 Ultra chip and 256GB of memory starts at $10,799, while a 512GB configuration is expected later this month. Apple has also begun inviting select media representatives to a product launch experience in Los Angeles on Wednesday, October 28.
M6 ProM6 MaxM6 UltraApple, MetaTrendForce

Thu, Oct 15

23:30Impact score 60
[News] Samsung May End UMC’s Galaxy DDI Exclusivity by Adding GlobalFoundries as Mature-Node Capacity Tightens
According to ZDNet citing industry sources, Samsung is considering adding GlobalFoundries as a second foundry partner for display driver ICs (DDIs) used in its OLED Galaxy smartphones, potentially ending UMC's exclusive role in manufacturing the chips; GlobalFoundries-produced DDIs could appear in Galaxy smartphones as early as late 2027, with some lower- and mid-range Galaxy A series models possibly the first to adopt the chips. Samsung is reportedly evaluating GlobalFoundries' 22nm or 28nm nodes, which have compatible manufacturing facilities in Singapore and Germany. The stated cause: mature-node demand has outpaced supply since the second half of 2025, and per ZDNet, Samsung requested expedited DDI production for its Galaxy Z Fold8 after demand exceeded expectations following its July unveiling, but UMC was unable to fulfill the request because its 22nm DDI production capacity had already reached its limit; as a result, Samsung cut its planned Galaxy Z Fold8 component production volume for September by 10%, shifting the deferred volume to October. Per Economic Daily News, institutional investors expect UMC's 12-inch capacity utilization to reach 93% by the end of 2026, supported by rising 22/28nm DDI orders from Samsung System LSI and Novatek and demand for Apple Mac-related chips on 55/65nm nodes; per TrendForce, some capacity-constrained 12-inch mature nodes showed signs of 5–10% price increases between Q2 and Q3 2026, with broader price hikes expected in 2027. These items remain reports/evaluations or expectations, not confirmed actions.
display driver IC (DDI)Samsung, UMC and 3 totalTrendForceCapacity Change
22:33Impact score 50
RT NEWS: #AdvancedPackaging: TSMC says nobody else is in production at 5X reticle size — and C.C. Wei hints TSMC will step in if EMIB-T falls short F...
According to an Oct 15 post, TSMC stated on its 3Q26 earnings call (10/15) that nobody else is in production at 5X reticle size, and C.C. Wei hinted that TSMC will step in if EMIB-T falls short — a conditional remark, not a confirmed plan or completed action. The call also included exchanges on CoWoS, Intel's EMIB-T and GlobalFoundries; the speakers' full remarks were not expanded in the truncated post.
CoWoSEMIB-T5X reticle size advanced packagingTSMC, Intel and 3 totalTrendForce Official (Market Data)
19:30Impact score 60
ASML struggling to keep up with demand for chipmaking equipment as AI spending continues to boom
ASML published its Q3 2026 earnings on October 14, 2026, saying the unprecedented spending and investment brought about by the AI boom is not slowing down, with customers already lining up to place orders for its advanced chipmaking tools for 2029 and 2030 output; CEO Christophe Fouquet said the company would struggle to meet demand despite plans announced in July to raise capacity by 30% in 2027 and another 30% in 2028. The company also confirmed it will raise prices starting in 2027, with the full effect showing in 2028. The Q3 2026 report detailed a net profit of €4.96 billion on net sales of €11.7 billion; the company projects Q4 sales of €14.2 billion to €15.2 billion ($15.9 billion to $17 billion) and boosted its full-year sales projections from at least €43 billion to €44-45 billion. ASML's shares rose 2% on Wednesday, up almost 70% so far this year, with its €586 billion market valuation making it Europe's largest firm by market cap. Additionally, Terafab will reportedly receive its first EUV chipmaking tool from ASML in mid-2027; CFO Roger Dassen said it is "still kicking the tires on the exact size of that (Terafab) opportunity."
advanced chipmaking toolsEUV chipmaking toolASMLTom's HardwareCapacity Change

Analog	$0.68	−5.9%
Connector	$0.75	+0.2%
CPU	$386.74	−21.3%
DDR4	$88.40	−0.2%
DDR52026-W13	$14.89	−11.2%
GPU	$478.20	+8.2%
MCU	$0.68	−61.7%Unusual
MLCC	$0.01	+54.0%Unusual
MOSFET	$0.12	−82.8%Unusual
PMIC2026-W13	$0.44	−12.5%
SSD/HDD	$288.43	n/a

NuAxi Stream - Real-Time Semiconductor Intelligence

Mon, Oct 19

[News] MediaTek’s Google TPU v9 Shipments May Slip to 1Q28; ASIC Race Heats Up as Taiwan Firms Eye Opportunities

Sun, Oct 18

CEO Interview with Dr. Raj Talluri of Kulicke & Soffa

“Korea, Taiwan Couldn’t Have Succeeded Without US”: SEMI Americas Chief

Intel to Launch Razor Lake AX Robotics SoC in 2028

Intel Unveils AI Inference Software Optimized for Xeon CPUs

ASUS Makes Its First Intel Arc Card, a 32 GB Arc Pro B70 Under the UGen AI Brand

Intel "Razor Lake-AX" to Pack 700 TOPS of AI Compute

Sat, Oct 17

Nvidia reportedly insists the RTX 5090 isn't dead despite severe shortages and removed listings at multiple retailers

China startup demoes prototype EUV light source

Fri, Oct 16

Terafab’s Single Roof: Why Packaging, Not Lithography, Decides High Volume

Intel "Nova Lake-HX" and "Nova Lake-H" Die Shots Appear

Corsair's Vengeance RGB DDR5 32GB memory receives a $108 price cut

Intel to Showcase Physical AI at Web Summit 2026

Analysis: Intel CEO Lip-Bu Tan's power of humility — how one phone call helped reshape the chip giant's comeback

Intel silent on Israeli Fab 28 output after deadly blast, leaving CPU supply outlook unclear

[News] After TSMC’s 3Q26 Earnings: Key Brokerage Takeaways as 2028 Capex Forecasts Reach US$105B

[News] Apple Reportedly Skips High-End M6 Chips for M7 Lineup; Partners With Meta to Run Muse AI on Mac Studio

Thu, Oct 15

[News] Samsung May End UMC’s Galaxy DDI Exclusivity by Adding GlobalFoundries as Mature-Node Capacity Tightens

RT NEWS: #AdvancedPackaging: TSMC says nobody else is in production at 5X reticle size — and C.C. Wei hints TSMC will step in if EMIB-T falls short F...

ASML struggling to keep up with demand for chipmaking equipment as AI spending continues to boom

Chip Teardown Lab2 opened

Component price indexNPI, vs. prior period

Trending components