NuAxiSemiconductor trade intelligence

Intel "Nova Lake-HX" and "Nova Lake-H" Die Shots Appear

What happened

Bare-die shots revealed via the Moore's Law Is Dead YouTube channel have exposed details of Intel's upcoming "Nova Lake" lineup for mobile devices. The "Nova Lake-HX" features an 8+16+4 core configuration with 8 P-Cores, 16 E-Cores, and 4 LPE-Cores, with total silicon measuring 12x30 mm amounting to 360 mm², divided across six dies on various nodes: the graphics tile is built on the Intel 3-E node, embedding 4 Xe GPU cores and covering roughly 26 mm²; a 21 mm² dummy die provides structural integrity of the package; a large 72 mm² die on the Intel 18A-P node hosts 4 LPE-Cores and serves as a central hub; another 18A-P die of 58 mm² functions as a peripheral control tile; the main compute tile is made at an external foundry on the TSMC N2P node and hosts the 8P+16E CPU core configuration, occupying the largest area of 104 mm²; a passive tile of 85 mm² sits beside it for the structural integrity of the package and the intended operation of the "Nova Lake-HX" chip. The less powerful "Nova Lake-H" variant features a 4+8+4 configuration with 4 P-Cores, 8 E-Cores, and 4 LPE-Cores; its package is significantly smaller at 12x23 mm for a total die area of 276 mm². The die configuration remains the same except for the main compute tile, which hosts a 4P+8E-core configuration on the TSMC N2P node occupying 55 mm²; its adjacent passive die is smaller at only 45 mm², while the peripheral control die, central hub die, and graphics tile are all made on Intel nodes and remain the same as in the "HX" variant.