The article introduces the concept of a 'Vertical System EM Corridor' for AI packaging, utilizing glass substrates and through-glass vias (TGVs) to address vertical signal/power routing needs in future heterogeneous systems. This represents a significant architectural shift in advanced packaging but lacks immediate supply chain or pricing data.
ByteDance is negotiating to purchase AI chips from Iluvatar CoreX and considering Baidu's Kunlunxin chips to meet rising inference demand from its Doubao chatbot.
SMTC has developed a MicroLED chip for CPO and entered sample validation in March, partnering with Hunan University to advance the technology.
Tensordyne has taped out an LNS-based AI chip, claiming an order of magnitude lower power consumption per token compared to GPU alternatives.
SMTC and Hunan Normal University established a joint lab for Micro LED CPO, targeting tape-out in 2026 and pilot production in 2028, alongside a 100 million unit/year laser chip production line. This vertical integration initiative supports the growing AI-driven demand for optical interconnects. Watch: Commercialization timeline is long-term; immediate supply chain impact is neutral.
China's Supreme Court upheld an injunction banning Infineon from selling GaN power chips in mainland China due to patent infringement, impacting Nvidia's 800V AI-rack supply chain. This victory for Innoscience creates a supply constraint in China, likely driving up prices for GaN components.
HYFIX CEO Mike Horton discusses the company's integrated platform for drones and autonomous robots, aiming to replace fragmented hardware stacks with a single, American-made solution to address supply chain dependence and reliability issues.
JPMorgan challenges the rumor of Intel winning a 3 million TPU order from Google, labeling it a 'storm in a teacup'. TrendForce and analysts are downplaying the scale of the reported deal. Bearish for Intel AI chip demand expectations.
Samsung Electronics will hold a semiannual strategy meeting from June 16 to 18 to review a split operating environment. Strong memory demand supports the chip business, while high component costs pressure consumer devices. Traders should monitor potential pricing adjustments in the memory sector amidst this demand divergence.
UCLA launches a $125 million semiconductor hub to utilize AI research for chip breakthroughs, aiming for high-impact innovations rather than incremental progress.
TrendForce reports that modern warfare is shifting towards unmanned, asymmetric UAV swarms driven by AI, increasing demand for defense procurement and chip sourcing.
SK Hynix's Cheongju campus suffered a fire, disrupting key memory-chip operations and evacuating thousands. This is the second incident in less than two weeks, raising safety concerns for semiconductor plants relying on hazardous gases. Bullish. Operational disruption may trigger supply shortages and price increases.
NextSilicon plans to productize its Arbel RISC-V core into a 64-core and 128-core server CPU for launch in Q1 2028. Designed for AI and HPC workloads, the chip targets 3.4 GHz operation on advanced nodes. This launch represents a significant step for RISC-V in the enterprise server market.
NVIDIA plans to open Vera CPU sales to China in August, with one major customer ordering over 300 servers, as H200 shipments stall. This move targets the inference market where Intel and AMD face severe supply constraints. Bullish for NVIDIA's CPU revenue and suppliers SK hynix and TSMC.
Rebellions is leveraging memory-centric AI chip designs in partnership with SK Hynix and Samsung to advance its IPO ambitions.
Micron selected Bechtel for its NY fab construction, targeting late 2030 and 2033 operations. This $50B expansion aims to shorten ramp-up times but threatens to lower DRAM ASPs due to subsidized costs.
Nvidia's regional chief denies Latin America serves as a smuggling corridor for restricted chips to China, citing increased screening of bulk orders from unfamiliar countries amid intensifying US-China AI rivalry.
AWS launched Graviton 5, a general-purpose Arm CPU, priced 9% higher than the previous generation while claiming 35% performance improvements for apps and ML inference.
Vishay expands its ILHB series of automotive-grade ferrite beads with higher current capability and smaller case sizes. This product launch targets automotive and industrial markets. No immediate price impact.
ABI Research estimates that operating a GPU in a space-based data center costs at least an order of magnitude more annually than a terrestrial facility, citing challenges like heat dissipation and radiation.
Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.
| Analog | $0.68 | −5.9% |
|---|---|---|
| Connector | $0.75 | +0.2% |
| CPU | $386.74 | −21.3% |
| DDR4 | $88.40 | −0.2% |
| DDR52026-W13 | $14.89 | −11.2% |
| GPU | $478.20 | +8.2% |
| MCU | $0.68 | −61.7%Unusual |
| MLCC | $0.01 | +54.0%Unusual |
| MOSFET | $0.12 | −82.8%Unusual |
| PMIC2026-W13 | $0.44 | −12.5% |
| SSD/HDD | $288.43 | n/a |