Fortune Advanced Technology is listing on the Emerging Stock Board on July 22, driven by surging demand for e-fuses and smart power management solutions in AI data centers. Higher-margin product shipments are boosting revenue, while the company seeks opportunities in substitute protective components.
Molex and Prysmian signed a 10-year agreement for optical cables to support AI data center growth, doubling Prysmian's domestic fiber capacity. This capacity expansion signals increased supply availability, which may alleviate current shortages. Bearish impact on spot prices.
Tower Semiconductor is expanding 300mm Silicon Photonics and SiGe capacity in Japan, targeting Q4 2027 production. Supported by the Japanese government, the expansion aims to meet long-term demand and achieve $3.6B revenue by 2028. Bullish for long-term supply security and company growth.
India is expanding its semiconductor strategy beyond fabs to include equipment, materials, and AI capabilities to increase its role in global electronics.
MiTAC Computing Technology showcased its high-density liquid-cooled rack solution featuring 96 AMD GPUs at the 2026 WAIC. This highlights the industry trend towards liquid cooling for AI servers.
The European Commission approved 659 million euros in German state aid for four semiconductor facilities. This move aims to expand European chip-making capacity and reduce supply chain dependencies. Bearish: Capacity expansion typically leads to increased supply, exerting downward pressure on prices.
VerifAIX introduces an AI-driven verification platform combining formal methods with LLMs to ensure chip design correctness. The tool automates testbenches and assertions to reduce bugs. This is a technology trend with no immediate supply chain impact.
ASML is reportedly planning price increases for existing Low-NA EUV tools, a move that could cost TSMC billions in additional capital expenditures. Despite TSMC's frustration, ASML CFO Roger Dassen confirmed that productivity gains justify these hikes, though implementation will take time due to long order lead times.
TSMC's A14 process node achieves near 90% device performance and 256Mb SRAM yield, marking a 5% and 10% improvement from April. This rapid maturation is attributed to accumulated experience with 2nd Gen GAA transistors. Watch: Strong interest from AI and HPC customers suggests robust future demand, though improved yields may alleviate supply constraints.
ASML plans to shift pricing for Low-NA EUV tools from productivity-based to value-based, targeting price increases for systems delivered after late 2028. This follows record order bookings and aims to capture more value beyond throughput. TSMC has expressed anger over the proposed changes.
ReElement Technologies Corp secured a $25 million grant from the US Department of War to expand refining capacity for rare-earth elements at its Marion facility. This funding aims to strengthen domestic supply chains for defense-critical minerals. The expansion plan signals a potential future increase in supply, which is bearish for spot prices.
PowerTech Technology and Broadcom are investing $400 million in a Singapore joint venture to build panel-level advanced packaging capacity for AI ASICs. This expansion aims to support the growing demand for high-performance computing chips. The move signals a bullish outlook on AI packaging capacity but poses a bearish risk of future oversupply.
TSMC confirmed at its July 16 earnings call that the A14 process is on track, with risk production set for 2027 and volume production slated for 2028. This roadmap update indicates continued progress in advanced packaging technology. No immediate impact on spot prices or supply is expected.
South Korean suppliers are ramping up R&D for hybrid bonding technology to support HBM5 and higher stack layers. As HBM stack layers increase, requirements for chip-to-chip bonding accuracy and signal transmission efficiency become more demanding. Bullish on advanced packaging tech breakthroughs, but no direct impact on spot prices in the short term.
US lawmakers urge Commerce Secretary Lutnick to tighten export controls on Chinese memory makers YMTC and CXMT. This move aims to prevent subsidized competition and PLA support amidst current shortages. The proposal threatens to cut off relief for OEMs and benefits Western manufacturers like Micron and Samsung.
Samsung Electronics has installed two High-NA EUV systems but delayed mass production to manage depreciation costs amid ongoing foundry losses. This cautious approach reflects a focus on profitability before full-scale deployment, despite improving 2nm yields.
FMC plans to build a €3 billion fab in Magdeburg, Germany, on the site previously targeted by Intel. The project requires government subsidies under the European Chips Act. Bullish for FMC and ferroelectric memory technology, indicating a potential revival of European memory manufacturing.
Rambus has introduced a PCIe 7 Switch IP with integrated Time Division Multiplexing (TDM) to address communication challenges in next-generation AI networking SoCs. This product doubles the data rate to 128 GT/s per lane, supporting the growing bandwidth demands of AI infrastructure. The launch complements Rambus's 29% year-over-year growth in interface IP business.
Microsoft has become the first hyperscale cloud provider to deploy 3M's Expanded Beam Optical (EBO) technology in Azure data centers. This strategic partnership aims to integrate AI infrastructure with enterprise digital transformation.
Demand validation for 3M's specific optical components.
CXMT's IPO filing reveals it spends a higher percentage of revenue on R&D than any peer for three consecutive years, despite trailing global leaders in most other metrics. This indicates a strategic focus on closing the technology gap. Neutral impact on current trading.
Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.
iPhone DuoFirst-pass chip map: 12 modules, 37 checkable identifiers (31 A / 6 B) and 19 public MPNs (16 externally searchable); A20 Pro, C2, N1 and the power/RF chains are located, while the NAND brand stays unconfirmed.All teardowns| Analog | $0.68 | −5.9% |
|---|---|---|
| Connector | $0.75 | +0.2% |
| CPU | $386.74 | −21.3% |
| DDR4 | $88.40 | −0.2% |
| DDR52026-W13 | $14.89 | −11.2% |
| GPU | $478.20 | +8.2% |
| MCU | $0.68 | −61.7%Unusual |
| MLCC | $0.01 | +54.0%Unusual |
| MOSFET | $0.12 | −82.8%Unusual |
| PMIC2026-W13 | $0.44 | −12.5% |
| SSD/HDD | $288.43 | n/a |