North American EMS bookings surged 44.3% YoY and 76% MoM in July, with a 3-month book-to-bill ratio of 1.29. Shipments lagged demand, falling 5.8% MoM, indicating a supply-demand imbalance. Bullish signal for semiconductor demand as order activity accelerates sharply.
The U.S. is negotiating with South Korea to secure billions of dollars in new investment from DRAM manufacturers on American soil. This move aims to address U.S. dissatisfaction with delays in Korean companies' expansion plans and supplements the $350 billion agreement reached last year. Traders should monitor the September announcement to assess the potential impact on capacity and pricing.
KYOCERA AVX and Mouser Electronics discuss the Anomalous Charging Current (ACC) in Polymer Tantalum Capacitors, its potential impact on switching power supplies and satellite power conversion, and KYOCERA AVX's solutions to mitigate the issue.
Coherent has initiated customer sampling of 300mm high-thermal-conductivity SiC substrates designed for AI and HPC thermal management. The substrates offer 25% improved heat spreading compared to current solutions. This milestone marks a transition from R&D to commercial evaluation, signaling future supply capabilities for advanced packaging.
EPC announced mass production of the EPC2370 GaN FET for AI power architectures, priced at $2.52 per unit. The device targets 6V high-current synchronous rectification in server power supplies. Bullish signal as supply ramps to meet growing AI computing demand.
Aratas America LLC launched the G3VH high-load-voltage SiC MOSFET relay, supporting 1,800V and 3,300V load voltages. The relay utilizes SiC technology for high voltage withstand capability and low on-resistance, targeting applications like semiconductor test equipment. Neutral signal.
BEL and Ananth Technologies signed an MoU to collaborate on the design and manufacturing of advanced electronic systems for defense and aerospace applications, including missiles and radars.
MacDermid Alpha is showcasing solder and sintering technologies designed to improve attach consistency in high-volume power electronics manufacturing. This highlights a focus on process optimization rather than immediate supply constraints. Neutral impact on current market pricing.
Samsung's zHBM reduces thermal resistance by 50% and increases density 10x, while liquid cooling penetration in AI chips is projected to rise to 60% by 2027. As 3D stacking exacerbates thermal challenges, the industry is shifting toward CPO and STCO solutions. Bullish for advanced packaging and cooling technologies.
TT Electronics has secured a multi-million pound lifetime contract with Rolls-Royce to supply mission-critical power electronics, including multi-chip power modules and precision magnetics, manufactured in the UK. This agreement extends a 40-year partnership and confirms long-term demand visibility for TT's specific power components. Bullish for TT Electronics' long-term revenue outlook.
SMIC posted record revenue of $3.01B and raised wafer prices for Q3, driven by 93.7% utilization and demand for AI logic chips and power management parts amid US export controls. The company is shifting from discounting to 'fairer pricing' to capture captive AI market share.
YMTC plans an A-share IPO to fund capacity expansion, surpassing Kioxia to become the world's third-largest NAND supplier. This move signals a shift from policy support to global competition. Bearish: Expansion plans suggest future supply increases.
SK hynix published a technology roadmap for co-packaged optics (CPO) in Nature Electronics, emphasizing the shift in AI competition towards system-level integration.
Samsung Electronics fully repaid a KRW20 trillion unsecured loan from Samsung Display in Q2 2026 ahead of schedule. This move was driven by AI-related demand lifting memory prices and strengthening the company's cash position.
Norwegian supplier Confidee reports standard FR-4 and copper-clad laminate shortages spreading from advanced materials, with lead times extending and pricing volatile through 2027.
CACI International opened a 61,000-square-foot manufacturing facility in Rochester, NY, increasing its defence electronics capacity by 300%. This facility serves as the primary production hub for electronic warfare systems for the US Army. The expansion indicates a strategic move to secure supply for defence electronics components.
Cerebras Systems launched the CS-4 AI accelerator, achieving up to 30x faster performance than GPU solutions. Built on three WSE-3 Turbo chips, it delivers 750 PFLOPs of compute and 10x throughput per watt. Bullish: The launch signals a significant competitive threat to incumbent GPU providers in the AI inference market.
Pixus Technologies has released the MIL Rugged N310 Software Defined Radio (SDR) with an extended temperature range of -40°C to +71°C. Based on the Ettus USRP family, the unit features external MIL-grade cooling and heating options. Neutral: This is a new product launch with no immediate impact on supply or pricing.
Top five NAND brands reported a 77% QoQ revenue surge to $68.87B, driven by AI server demand and ASP increases. Despite weak PC demand, continued price hikes and prioritized DRAM/HBM investment suggest sustained price support in Q3.
Samsung Foundry delays 1.4nm mass production to 2029, sticking with 2nm for three years. TSMC plans 1.6nm A16 mass production in H2 2026, while Samsung delays High-NA EUV adoption. Neutral. This is a roadmap adjustment with no immediate impact on spot prices.
Whose chips are really inside the hottest new products? We open them up and show you, one part at a time.
| Analog | $0.68 | −5.9% |
|---|---|---|
| Connector | $0.75 | +0.2% |
| CPU | $386.74 | −21.3% |
| DDR4 | $88.40 | −0.2% |
| DDR52026-W13 | $14.89 | −11.2% |
| GPU | $478.20 | +8.2% |
| MCU | $0.68 | −61.7%Unusual |
| MLCC | $0.01 | +54.0%Unusual |
| MOSFET | $0.12 | −82.8%Unusual |
| PMIC2026-W13 | $0.44 | −12.5% |
| SSD/HDD | $288.43 | n/a |